[SI-LIST] Re: How can we get the resonance frequency and Q between the package and the board from Z11?
- From: Ihsan Erdin <erdinih@xxxxxxxxx>
- To: luping liu <liewluping@xxxxxxxxxxxx>
- Date: Sun, 2 Dec 2012 09:09:44 -0500
Hi Liu,
The obvious way is to take two sets of measurements on the board: one
populated with the chip and the other without it.
Regards.
Ihsan
On Sun, Dec 2, 2012 at 8:13 AM, luping liu <liewluping@xxxxxxxxxxxx> wrote:
> Hi Ihsan:
>
> Thank you for your reply,that's impossible to characterize the
> package, how about just know the anti resonance between the package
> inductance and the PCB capacitance?
>
> Regards,
>
> LIU Luping
>
> --- *12Äê12ÔÂ1ÈÕ£¬ÖÜÁù, Ihsan Erdin <erdinih@xxxxxxxxx>* дµÀ£º
>
>
> ·¢¼þÈË: Ihsan Erdin <erdinih@xxxxxxxxx>
> Ö÷Ìâ: Re: [SI-LIST] How can we get the resonance frequency and Q between the
> package and the board from Z11?
> ÊÕ¼þÈË: liewluping@xxxxxxxxxxxx
> ³ËÍ: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
> ÈÕÆÚ: 2012Äê12ÔÂ1ÈÕ,ÖÜÁù,ÉÏÎç8:45
>
> Liu,
>
> Unless you can remove the die from the package it is impossible to isolate
> the package characteristics from the package-die combination. You simply
> don't have enough information to do that.
>
> Regards
>
> Ihsan
>
>
> On Thu, Nov 29, 2012 at 9:54 AM, luping liu
> <liewluping@xxxxxxxxxxxx<http://mc/compose?to=liewluping@xxxxxxxxxxxx>
> > wrote:
>
> Dear Experts:
>
> If we have a board with a "blackbox" chip,which means we know nothing
> about the package and the die details, how can we get the anti-resonance
> frequency and Q between the package and the board ? The measurement we can
> do is the Z11 looking from the PCB (with the BGA chip mounted or a bare
> board with decouple capacitor) with a two port VNA test.Is it possible to
> get the Cpackage and Cdie?
>
> Thanks and Regards,
>
> LIU Luping
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> --
> Ihsan Erdin
>
>
--
Ihsan Erdin
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