[SI-LIST] High IO 1mm Pitch FPGAs Top Bottom Board Assembly
- From: "Harjeet Randhawa" <harjeet.randhawa@xxxxxxxxxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 15 Jan 2004 18:21:05 +0530
HI All,
My design has a very high count (approx 20) 1mm pitch FPGAs with 1164
Ios.(part number XV2VP100)
There is reasonable amount of interconnections between a few paired
FPGAs.
So I am exploring the option that whether I can place the FPGAs on the
component side of my PCB to ease the routing effort.
Need to check the feasibility/yield issues for this assembly process?
Whether it is practical at all.
What are the known issues which need to taken care for the same?
This is a evaluation platform so a few prototypes only are required to
be assembled.
Thanking you all in advance,
With best regards,
Harjeet Singh.
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