[SI-LIST] Future Directions in IC and Package Design Workshop (FDIP)
- From: "Ray Anderson" <ray.anderson@xxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Fri, 30 Mar 2007 09:56:53 -0700
Si-list:
The following announcement of the Future Directions in IC and Package
Design Workshop (FDIP) has been posted at the request of one of the
Workshop Chairs, Alina Deutsch ( deutsch@xxxxxxxx ) .
Please direct any questions on the FDIP Workshop to either her or her
co-chair Madhavan Swaminathan ( madhavan.swaminathan@xxxxxxxxxxxxxx ).
Ray Anderson
si-list admin
------------------------------------------------------------------------
-------------------------------------------------
Final Program
Future Directions in IC and Package Design Workshop (FDIP)
October 28, 2007, Atlanta, GA
sponsored by: IEEE Components, Packaging and Manufacturing Society
organized by: CPMT Technical Committee on Electrical Design, Modeling,
and Simulation (TC-EDMS)
1:15pm - 1:30 pm Welcome Remarks, Alina Deutsch, IBM, Madhavan
Swaminathan, GIT
SESSION I: SYSTEM DESIGN
1:30pm - 4:00 pm
Session Chair: George Katopis - IBM Corporation
1:30pm - 2:05pm Signal Bandwidth for High Performance
Computing - Dale Becker, IBM Corporation
2:05pm - 2:40pm Wireless Proximity Communications for 3D System
Integration - Tadahiro Kuroda, Keio University
2:40pm - 3:15pm A Critical Assessment of the State of the Art in
Multiscale Multiphysics Modeling of Microelectronics - Jayathi Murthy,
Purdue University
3:15 - 4:00 pm -Refreshment Break
SESSION II: POWER DISTRIBUTION
4:00pm - 5:55 pm
Session Chair: Gregory Taylor, Intel Corporation
4:00pm - 4:35pm Power Delivery Challenges for Mobile Platforms - Tawfik
Arabi, Intel Corporation
4:35pm - 5:10pm Modeling Challenges for Power Distribution
Analysis - Madhavan Swaminathan, Georgia Institute of Technology
5:10pm - 5:45pm Power Delivery System Design Challenges and
Explorations on How to Overcome Them - Jiayuan Fang, Sigrity, Inc
5:45pm - 5:55 pm Closing Remarks, Madhavan Swaminathan, GIT, Alina
Deutsch, IBM
Presentations will be posted on the IEEE CPMT Society web page at:
http://www.ewh.ieee.org/soc/cpmt/tc12/
Workshop Chairs:
Alina Deutsch IBM Watson Research Center
Madhavan Swaminathan Georgia Institute of Technology
Technical Program Committee:
Tawfik Arabi - Intel Oregon
Mahadevan Iyer - IME, Singapore
Andreas Cangellaris - University of Illinois
George Katopis - IBM Poughkeepsie
Moises Cases - IBM Austin
Istvan Novak - SUN
Chi-Shih Chang - Consultant
Toshio Sudo - Toshiba, Japan
Paul Franzon - North Carolina State University
Gregory Taylor - Intel Oregon
Hartmut Grabinski - University of Hanover, Germany
Harold Hosack - Semiconductor Res. Corp.
Lewis Terman - IBM Watson Research
Brian Young - Texas Instruments
Workshop will be held at the Renaissance Atlanta Hotel, 590 W. Peachtree
St, NW, Atlanta, GA 30308 (404) 881-6000 fax: (404) 815-5350.
The hotel is holding a block of rooms for participants at a special rate
of $199.00 plus tax. Room reservations must
be made by September 27, 2007 to guarantee this rate. After that time
rooms will be on a space and rate available basis only.
Be sure to mention that you are attending the Electrical Performance of
Electronic Packaging conference. Rooms are
limited so make your reservations early. Additional information can be
obtained at http://www.epep.org <http://www.epep.org/>
Additional information may be obtained from the workshop chairs:
Alina Deutsch deutsch@xxxxxxxx
phone: (914) 945-2858
fax: (914) 945-2141
Madhavan Swaminathan madhavan.swaminathan@xxxxxxxxxxxxxx
phone: (404) 894-3340
fax: (404) 894-9959
and the workshop administration:
epd@xxxxxxxxxxxxxxxx
phone: (520) 621-3054
fax: (520) 621-1443
Attendees interested in the workshop will be charged a $60.0 fee that
will cover afternoon refreshments, digest of
abstracts, and posting of the foils on the CPMT Society TC-EDMS web
site. All attendees must register by
September 10, 2007 using the EPEP'07 website at www.epep.org in order to
assure that the workshop is being
held. On-site registrants will be admitted depending on availability of
seating.
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field
or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list
For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field
List technical documents are available at:
http://www.si-list.net
List archives are viewable at:
//www.freelists.org/archives/si-list
or at our remote archives:
http://groups.yahoo.com/group/si-list/messages
Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu
Other related posts:
- » [SI-LIST] Future Directions in IC and Package Design Workshop (FDIP)
