[SI-LIST] Re: Flooded Vias vs Thermal Relief

  • From: wjcsongr@xxxxxxxxxxxxxxxxxxx
  • To: Jack Olson <pcbjack@xxxxxxxxx>
  • Date: Fri, 19 Mar 2010 09:18:04 -0500

Manufacturing might piss and moan so you might want to ask them about the 
thermals.
Just don't put thermals on press fit connectors: - )

Regards,

Bill

William Csongradi
Senior Electrical Engineer
Rockwell Collins Heads Down Display Center
319-295-7884

Mailing Address
Rockwell Collins
400 Collins Road NE
MS 105-167
Cedar Rapids, Iowa 52498-0001





Jack Olson <pcbjack@xxxxxxxxx> 
Sent by: si-list-bounce@xxxxxxxxxxxxx
03/19/2010 08:43 AM

To
SI-LIST <si-list@xxxxxxxxxxxxx>
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Subject
[SI-LIST] Flooded Vias vs Thermal Relief






Greetings,
I am being instructed to flood all vias instead of using thermal relief, 
to
get a "better" connection to planes. I've typically used thermal reliefs
simply because they are easier to see in checking or design reviews (but 
its
only one mouse click for me to change them so I'm not really complaining).

but it got me thinking.....

Have any test results ever showed that spokes have a significant impedance
or anything that can change circuit performance?
(and I'm referring to 12mil plated through-hole vias on boards 100MHz max)

I don't remember anyone ever talking about that.

surfin' the learnin' curve,
Jack


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