Hi, I have few analog power supplies for a chip to be packed in a BGA package. Two options are considered. The first is to short all analog supplies on the BGA and have a better/bigger supply plane. The second option is to short it on the board. Since we are talking about a BGA package, the inductance of the package is very small. 1) Can I say, based on the above, that the noise introduced between analog domain if its being shorted on package is the same to the option in which its being shorted on board? 2) Which option will introduce less noise between supplies, i.e. ? 3) Which option is better in decoupling noise (decoupling of noise generated in this power supply) any input and/or reference is welcomed with thanks in advance!!! yehuda ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Yehuda D. Yizraeli Mysticom LTD E-mail : yehuday@xxxxxxxxxxxx 1st Zoran st, #6 Direct Tel: 972-9-8636-497 P.O.B. 8364, Netanya 42504 Operator : 972-9-8636-465 ISRAEL Cellular : 972-57-556-335 Fax : 972-9-8636-466 <http://www.mysticom.com> ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu