images download here: http://www.bychoice.com/pcb_cracks.zip We are asking if any of you have seen radial cracks around thru-holes like those imaged in a microsectional analysis of a 14-layer PCB (Polyimide laminate, see attached examples). The specimens were microsectioned in the horizontal plane. In every image, the cracks run outward (perpendicular) from the hole wall, they are not randomly directed. The cracks appear to be partially copper filled indicating they probably existed prior to the Through-hole Plating process. Not all layers showed cracks and the crack patterns appear different on different layers (TBR). The original problem that lead to the microsection was high impedance shorts to ground (100's of ohms) on two pins of the installed connector with hole registration the suspected cause. What came back were images of these radial cracks, no registration problem. No definitive proof of any crack as cause for any shorting was determined, but appears leading. If anyone has seen this before, what is it, what might be the cause(s)? (process, material, ?) What are the probable effects of aging (thermal/humdity) on crack propagation? Thanks in advance, Mike Massa/Steve Salkow Lockheed Martin 3200 Zanker Road San Jose, CA 95134 steven.salkow@xxxxxxxx ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu