[SI-LIST] Re: Excellent patents for 3D IC and system integration of IC + package + PCB Patent
- From: steve weir <weirsi@xxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 08 Apr 2013 17:17:16 -0700
Robert: What part of advertising products is prohibited on the SI-LIST
did you miss?
Steve
On 4/8/2013 5:01 PM, Hsiuan-ju Hsu wrote:
> Dear SI experts,
> Here are two excellent patents for your reference. Please contact
> me (hsiuanju@xxxxxxxxxxx) if you are interested with them.
>
> 1. Patent (US 8,153,906) for Non-exclusive License or for sales:
> Interconnection structure for improving signal integrity
>
> To the one who may be interested in the patent:
> The embodiment of the invention is about a novel interconnection structure
> which can
> be incorporated into a variety of connectors, as well as other types of
> interconnections
> in order to reduce crosstalk, to improve signal integrity and to achieve EM
> emission
> compliance.
> A 4-via (2 signal vias, 1 power via, and 1 ground via) interconnection
> structure was
> used for demonstrating the effect of the novel interconnection structure. The
> same
> concept can be applied to any multi-via and multi-layer interconnection
> structure such
> as PCB, IC packaging circuit, or die circuit. Vias that have an electrical
> property can
> be added adjacent to the basic 4-via interconnection structure to achieve a
> multi-via
> interconnection structure. For 1-via (1 signal via or 1 power via), 2-via (1
> signal via
> and 1 ground via or 1 signal via and 1 power via) and 3-via (1 signal via, 1
> ground via,
> and 1 power via) interconnection structure, the proposed interconnection
> structure
> based upon the same concept can be applied as well.
>
> 2. Patent (US 8,084,695) for Non-exclusive License or for sales:
> Via structure for improving signal integrity
>
> To the one who may be interested in the patent:
>
>
> The embodiment of the invention
> is about a novel via structure which can be incorporated into printed circuit
> boards, integrated circuit packages, and integrated circuits in order to
> reduce
> crosstalk, to improve signal integrity and to achieve EM emission compliance.
> A
> 4-layer (2 signal layers and 2 power layers or 2 signal layers and 2 ground
> layers) circuit board assembly was used for demonstrating the effect of the
> novel via structure. The same concept can be applied to any multi-layer
> circuit
> board. Layers that have an electrical
> property can be added above, under, or within the basic 4-layer circuit board
> to achieve a multi-layer circuit board. For 2-layer and 3-layer circuit
> boards,
> a deformed version of the proposed via structure based upon the same concept
> will be needed for a coplanar waveguide configuration.
>
>
> Robert Hsu
>
>
>
>
>
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--
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