[SI-LIST] Excellent patents for 3D IC and system integration of IC + package + PCB Patent
- From: Hsiuan-ju Hsu <hsiuanju@xxxxxxxxxxx>
- To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
- Date: Tue, 9 Apr 2013 00:01:35 +0000
Dear SI experts,
Here are two excellent patents for your reference. Please contact me
(hsiuanju@xxxxxxxxxxx) if you are interested with them.
1. Patent (US 8,153,906) for Non-exclusive License or for sales:
Interconnection structure for improving signal integrity
To the one who may be interested in the patent:
The embodiment of the invention is about a novel interconnection structure
which can
be incorporated into a variety of connectors, as well as other types of
interconnections
in order to reduce crosstalk, to improve signal integrity and to achieve EM
emission
compliance.
A 4-via (2 signal vias, 1 power via, and 1 ground via) interconnection
structure was
used for demonstrating the effect of the novel interconnection structure. The
same
concept can be applied to any multi-via and multi-layer interconnection
structure such
as PCB, IC packaging circuit, or die circuit. Vias that have an electrical
property can
be added adjacent to the basic 4-via interconnection structure to achieve a
multi-via
interconnection structure. For 1-via (1 signal via or 1 power via), 2-via (1
signal via
and 1 ground via or 1 signal via and 1 power via) and 3-via (1 signal via, 1
ground via,
and 1 power via) interconnection structure, the proposed interconnection
structure
based upon the same concept can be applied as well.
2. Patent (US 8,084,695) for Non-exclusive License or for sales:
Via structure for improving signal integrity
To the one who may be interested in the patent:
The embodiment of the invention
is about a novel via structure which can be incorporated into printed circuit
boards, integrated circuit packages, and integrated circuits in order to reduce
crosstalk, to improve signal integrity and to achieve EM emission compliance. A
4-layer (2 signal layers and 2 power layers or 2 signal layers and 2 ground
layers) circuit board assembly was used for demonstrating the effect of the
novel via structure. The same concept can be applied to any multi-layer circuit
board. Layers that have an electrical
property can be added above, under, or within the basic 4-layer circuit board
to achieve a multi-layer circuit board. For 2-layer and 3-layer circuit boards,
a deformed version of the proposed via structure based upon the same concept
will be needed for a coplanar waveguide configuration.
Robert Hsu
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