[SI-LIST] Ensure Signal Integrity... track 14 at DesignCon2015
- From: "Yuriy Shlepnev" <shlepnev@xxxxxxxxxxxxx>
- To: "'SI LIST'" <si-list@xxxxxxxxxxxxx>
- Date: Wed, 25 Jun 2014 12:04:07 -0700
Hello Everyone,
This is just a reminder that the deadline to submit a proposal for the next
DesignCon 2015 is July 11, 2014 - it may be time to start working on the
abstract.
Here is the link to the website for more info
http://www.designcon.com/santaclara/call-for-abstracts/.
I am co-organizing track 14 "Ensure signal integrity with RF/Microwave/EM
analysis techniques".
Sample topics for this track are:
Electromagnetic analysis of interconnects;
Interconnect analysis validation with measurements;
S-parameters in analysis of broad-band interconnect systems;
RF/Microwave techniques for digital interconnects (e.g. de-embedding,
equalization, filtration);
Embedded passive components (e.g., capacitors, inductors, delay lines);
Analysis of losses, dispersion, coupling and mode conversion in
interconnects;
Broadband dielectric and conductor characterization (e.g., loss and
dispersion, roughness, anisotropy, fiber-weave effect);
Material parameters identification;
Effects of discontinuities in interconnects (e.g., vias, connectors,
launches, transitions, serpentines);
Modeling of THz and optical interconnects;
If you have something interesting along those lines and would like to share
your results with the DesignCon audience, please submit a proposal for track
14.
Best regards,
Yuriy
Yuriy Shlepnev, Ph.D.
President, Simberian Inc.
3030 S Torrey Pines Dr. Las Vegas, NV 89146, USA
Office +1-702-876-2882; Fax +1-702-482-7903
Cell +1-206-409-2368; Virtual +1-408-627-7706
Skype: shlepnev
www.simberian.com
Simbeor - Accurate, Fast, Easy and Affordable Electromagnetic Signal
Integrity Software
2010 and 2011 DesignVision Award Winner
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Yuriy Shlepnev
Sent: Tuesday, July 2, 2013 6:52 AM
To: 'SI LIST'
Subject: [SI-LIST] Ensure signal integrity... track at DesignCon2014
Hello Everyone,
This is just a reminder that the deadline to submit a proposal for the next
DesignCon is July 26, 2013 - it may be time to start working on it. Here is
the link to the website for more info
http://www.designcon.com/santaclara/call-for-submissions/.
I am co-organizing track 14 "Ensure signal integrity with RF/Microwave/EM
analysis techniques".
Sample topics for this track are:
Electromagnetic analysis of interconnects
Interconnect analysis validation with measurements
S-parameters in analysis of broad-band interconnect systems
RF/Microwave techniques for digital interconnects (e.g. de-embedding,
equalization, filtration)
Embedded passive components (e.g., capacitors, inductors, delay lines)
Analysis of losses, dispersion, coupling and mode conversion in
interconnects
Broadband dielectric and conductor characterization (e.g., loss and
dispersion, roughness, anisotropy)
Material parameters identification
Effects of discontinuities in interconnects (e.g., vias, connectors,
launches, transitions, serpentines)
THz and optical interconnects
If you have something interesting along those lines and would like to share
your results with the DesignCon audience, please submit a proposal for track
14.
Best regards,
Yuriy
Yuriy Shlepnev, Ph.D.
President, Simberian Inc.
3030 S Torrey Pines Dr. Las Vegas, NV 89146, USA Office +1-702-876-2882; Fax
+1-702-482-7903 Cell +1-206-409-2368
Skype: Shlepnev
www.simberian.com
Simbeor - Accurate, Fast, Easy and Affordable Electromagnetic Signal
Integrity Software
2010 and 2011 DesignVision Award Winner
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