[SI-LIST] Employment Opportunity with FormFactor Inc (Singapore)
- From: Viveka MP <vivekamp@xxxxxxxxxxxxxx>
- To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
- Date: Sat, 25 May 2013 11:33:05 +0000
HI All,
We have the following positions currently open in our Company, interested
candidate Please email me at vivekamp@xxxxxxxxxxxxxx
1)Principal Signal Integrity Engineer
Requirements:
5 to 7 years working in a high-tech environment with at least 3+ of those years
in Signal Integrity analysis and development, working with a cross functional
group.
BS/MS in Electrical Engineering is required
Self-motivated with the ability to work well with others in a team environment
Experience with signal integrity design with emphasis on power distribution at
a system level in PCB and/ or packaging,
Experience with 3D modeling tools as well as spice simulation tools
Experience with laboratory measurements using equipment such as oscilloscopes,
vector network analyzers, spectrum analyzers and time domain reflectometers
Excellent analytical, design, and debug skills
Able to travel within Asia at relatively short notice.
Good verbal and written communication skills
Senior/ Engineer, Electrical Design
(Fresh graduates welcome)
Responsibilities:
* Custom design of Advanced Probe Cards for wafer level testing based
on MEMS technology.
* Execute the feasibility analysis of a new probe card design and
prepare report for customer feedback in a timely manner
* Responsible for the overall design schedule to ensure on-time
delivery while maintaining good design quality
* Interact with various local and international engineering departments
* Contribute to design process improvement activities
* Participate in CAD tool development
* Train other Engineers in the design process using commercial and/or
internal CAD tools
Requirements:
* Masters/Bachelor's Degree in Electrical/Electronics Engineering or
equivalent
* Experience in probe card design or application is preferred
* Fresh graduates are welcome to apply
* Candidates with related experience in hardware board level design,
test interface design, semiconductor test or semiconductor product
engineering-related field will have an advantage
* Knowledge in Signal Integrity and high speed design
* Experience in AutoCAD drafting and MS Excel
* Basic programming skill and/or Visual Basic scripting in MS Excel are
an added advantage
* Must be able to accomplish project turnaround within tight deadline
* Fluent in English
Company Overview
FormFactor is the leader in advanced wafer probe cards, which are used by
semiconductor manufacturers to electrically test integrated circuits (ICs)
while they are still on the wafer. The company's wafer sort, burn-in and device
performance testing products move IC testing upstream from post-packaging to
the wafer level, enabling semiconductor manufacturers to bring next-generation
devices to market faster while reducing their overall cost of test and
improving their yields. FormFactor Transforming Test FormFactor's advanced
wafer probe card solutions help semiconductor manufacturers overcome these
challenges and accelerate their return on investment by enabling them to screen
the quality of their die on the wafer and ensure that only die that meet their
specifications are subsequently packaged. Chipmakers can also feed this test
data back to their manufacturing operations to improve their fabrication
processes several weeks sooner than if the test information was obtained after
packaging. This ability to optimize two key manufacturing parameters-cost of
test and yield-is a leading reason why IC manufacturers are increasingly
turning to FormFactor's solutions.
At the core of FormFactor's product portfolio is its patented MicroSpring(r)
interconnect technology and proprietary design processes. The MicroSpring
contactor's resilient, spring-like elements provide low contact force to permit
testing without damaging semiconductors, particularly those incorporating
fragile next-generation materials like low-k dielectrics. MicroSpring contacts
are manufactured through precision micromachining and semiconductor-like wafer
fabrication processes-making them highly scalable to shrinking semiconductor
geometries. The contacts include geometrically precise tip structures, which
enable reliable electrical contact over hundreds of thousands of touchdowns
with minimal maintenance.
By utilizing its extensive library of MicroSpring intellectual property,
FormFactor can develop customized wafer probe cards to accommodate customers'
unique product designs. Another key strength of FormFactor's products is their
ability to enable high test parallelism. Reducing test costs requires the
ability to increase the number of die tested (parallelism) during each
touchdown on the wafer surface. This improves test cell throughput by reducing
the number of touchdowns and the total time needed to test each wafer, which in
turn means that fewer testers are needed to provide the required test capacity.
FormFactor pioneered the concept of wafer-level parallelism with its TRE(r)
technology, which significantly increases the number of ICs that can be tested
on a wafer simultaneously. The result is lower total cost of test, helping IC
manufacturers fully realize the financial benefits of 300-mm wafer
manufacturing.
History
Founded in 1993, FormFactor established its headquarters, R&D and manufacturing
operations in Livermore, Calif., in 1995. That same year, FormFactor introduced
its first wafer probe card based on its MicroSpring technology. FormFactor
completed its initial public offering of stock on June 11, 2003, and is traded
on the Nasdaq National Market under the symbol FORM. Today, FormFactor has over
700 employees worldwide, with sales, service and design centers in North
America, Europe, Japan, Korea and Taiwan.
http://www.formfactor.com/
Regards
Vivek
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