Hello Experts,
Does anyone have an experience with using embedded components within the
substrate of a PCB?
It's interesting to see if the through transmission performance can be
optimized by using embedded AC caps instead of mounting the caps on the top
surface.
My understanding is that antipad geometry would still need to be
implemented to keep the AC cap structure matched to say 50ohm.
Look forward to your inputs,
Thank you.
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field
or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list
For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field
List forum is accessible at:
http://tech.groups.yahoo.com/group/si-list
List archives are viewable at:
//www.freelists.org/archives/si-list
Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu