[SI-LIST] Re: Electroless Ni-Au Plating impact on microstrip losses

  • From: "Scott McMorrow"<scott@xxxxxxxxxxxxx>
  • To: "Howard Johnson"<howie03@xxxxxxxxxx>, si-list@xxxxxxxxxxxxx
  • Date: Fri, 27 Aug 2010 13:17:39 -0500

Howie
Thanks.  Yuriy and i have been discussing this.  Issue came up in a  
correlation study.  Results are striking in some applications. Everything  
i've read discusses loss only, but group delay distortion in the transition  
regions is quite stunning.

Sent via DROID on Verizon Wireless

-----Original message-----
From: Howard Johnson <howie03@xxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Sent: Fri, Aug 27, 2010 17:14:30 GMT+00:00
Subject: [SI-LIST] Electroless Ni-Au Plating impact on microstrip losses

Dear Scott,


Clyde Coombs' "Printed Circuit Handbook", 5th ed., section 32.4 incorporates
a good summary of the "Electroless Nickel / Immersion Gold" (ENIG) process,
plus several other related processes.  He quotes the typical layer
thicknesses, but does not mention high-frequency losses.  His book,
regarding ordinary pure Nickel plating, was the source of data I used in the
following overview article. The article is not a technical study, but does
describe the nature of the lossy effect: 

"Nickel-Plated Traces", (2002) http://www.sigcon.com/Pubs/news/5_6.htm

The immersion Gold platings added on top of Nickel are (according to Clyde)
so thin (much less than a skin depth at multi-gHz) than they have no bearing
on the losses -- it's as if you had an ordinary Nickel-plated trace as in my
2002 article.

Yuri Shlepnev has done a lot of work with boundary-layer field simulations
and may have more information on this topic. 

Best regards,
Dr. Howard Johnson, Signal Consulting Inc.,
tel +1 509-997-0505,  howie03@xxxxxxxxxx
www.sigcon.com -- High-Speed Digital Design seminars, publications and films
 



-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Scott McMorrow
Sent: Thursday, August 26, 2010 3:40 PM
To: silist
Subject: [SI-LIST] Electroless Ni-Au Plating impact on microstrip losses




Sorry about that.  This is the question I sent out.


  Is anyone aware of any published research on Ni-Au plating over Microstrip
and the impact on losses other than:

"Ni-Au Surface Finish Effects on RF Performance", D. Staiculescu, J. 
Laskar, J. Mendelsohn, E. Sweetman, D. Rudy and I. Artaki , IEEE MTT-S
Digest, 1999, pp 1909-1912.


-- 
Scott McMorrow
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