[SI-LIST] EPEPS: Oct 19-21 Portland, OR

From: Dale Becker <wbecker@xxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Wed, 30 Sep 2009 20:23:35 -0400

Dear Si-List,

Just a reminder that the 2009 IEEE EPEPS (Electrical Performance of
Electronic Packaging and Systems) is Oct. 19-21 in Portland, OR.

The program, registration and other conference information is at
http://epeps.org.

Please note the special programming for this year includes three
embedded tutorials.

Monday Tutorial
Fundamentals of Macromodeling for Signal Integrity Analysis
Presented by: Dr. Piero Triverio, Politecnico di Torino and Dr. Michel
Nakhla, Carleton University

Tuesday Tutorial
Fundamentals and Advances in Jitter Analysis of High-Speed Links
Presented by: Dr. Lei Luo, Rambus

Wednesday Tutorial
Challenges in Measuring High Speed Links
Presented by: Dr. Kathleen Melde, University of Arizona and Terry Burcham,
Cascade Microtech

In addition on Sunday afternoon, Oct. 18 is this year's edition of
FDIP (Future Directions in IC and Package Design) and the agenda for
that program is on the Courses/Workshop tab at the EPEPS website,
http://epeps.org.

I look forward to seeing many of the si-listers there.

Dale Becker, IBM Corp., EPEPS Co-Chair

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[SI-LIST] EPEPS: Oct 19-21 Portland, OR

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