[SI-LIST] EPEPS - Call for Papers - Deadline Extended

From: "MacGregor, Kara Lynn" <kmacgreg@xxxxxxxxxxxx>
To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
Date: Thu, 30 Jun 2011 21:33:34 +0000
Dear Members,
EPEPS-2011 Paper Submission Deadline Extended to 14th July 2011.

Due to many requests, the paper submission deadline has been extended to 14th 
July 2011. Details of call for papers and submission can be found at the 
website http://epeps.org<http://epeps.org/>.

The conference is held during Oct. 23-26, 2011, in the Silicon Valley, San 
Jose, CA. Also there are great opportunities provided this time for companies 
to showcase their products/brands through structured sponsorships/exhibitions, 
details of which can be found in the exhibits 
link<http://epeps.ece.illinois.edu/exhibits.html>. We look forward to your 
participation in this premier conference on signal integrity, interconnects and 
electronic packaging.

For more information, please contact EPEPS administrator, Mandy Wisehart via 
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.

Sincerely,
EPEPS Co-Chairs: Ram Achar, Carleton University & Brian Young, Texas Instruments

-----------------------------------------------------------------------------------------------------------------------------------------
20th IEEE International Conference on
Electrical Performance of Electronic Packaging and Systems
EPEPS 2011
October 23-26,     San Jose, CA
Extended Call for Papers
EPEPS (www.epeps.org<http://www.epeps.org/>) is the premier international 
conference on advanced and emerging issues in electrical modeling, analysis, 
synthesis and design of electronic interconnections, packages and systems. It 
also focuses on new methodologies and CAD/design techniques for evaluating and 
ensuring signal, power and thermal integrity in high-speed designs. EPEPS is 
jointly sponsored by the IEEE Components, Packaging and Manufacturing 
Technology Society and IEEE Microwave Theory and Techniques Society. Authors 
are invited to submit papers describing new technical contributions related to 
the broad area of electrical performance of high-speed designs, covering:

  1.  Emerging and advanced issues,
  2.  New design techniques and innovative architectures for design and 
management,
  3.  Novel CAD concepts, methodologies and algorithms for modeling, simulation 
and optimization,
with emphasis on:

  *   System-level, board-level and on-chip interconnects
  *   High-speed channels, links, backplanes, serial and parallel 
interconnects, SerDes
  *   Multiconductor transmission lines
  *   Memory and DDR interfaces
  *   Jitter and noise management
  *   Signal and thermal integrity
  *   Power integrity and power distribution networks (PDNs)
  *   Electronic packages and microsystems
  *   3D interconnects, 3D packages, TSVs and MCMs
  *   Nano interconnects and nano structures
  *   RF/microwave packaging structures, RFICs, mixed signal modules and 
wireless switches
  *   Package-chip co-design
  *   Electromagnetic (EM) and EM interference modeling, simulation algorithms, 
tools and flows
  *   Macromodeling including model order reduction as it applies to electrical 
analysis
  *   Advanced and parallel CAD techniques for signal, power and thermal 
integrity analysis
  *   Measurement and data analysis techniques for system-level and on-chip 
structures.
For a PDF version of the call for papers, please click 
here<http://epeps.ece.illinois.edu/cfp.pdf>

<http://epeps.ece.illinois.edu/cfp.pdf>
Submission Deadline: July 14, 2011, 8pm, PST
Submission Format: 2 column, 4 page, PDF format only.

Information for authors can be found at www.epeps.org<http://www.epeps.org/>. 
Submitted manuscripts should be camera ready and compliant with the general 
standards of the IEEE, including appropriate referencing. Noncompliant 
manuscripts will not be considered for review.
Location: Doubletree Hotel, 2050 Gateway Place, San Jose, CA 95110, USA
Tutorials/Workshops: EPEPS offers tutorials or short courses on 
state-of-the-art topics during the conference.
Sponsorships/Exhibits: EPEPS offers an excellent opportunity for 
sponsorships/exhibits. EPEPS is an exciting forum for vendors to demonstrate 
their state-of-the-art-tools to the attendees. Interested vendors can contact 
the conference administration for more details.
Conference Co-chairs:

  *   Ramachandra Achar, Carleton University :
  *   Brian Young, Texas Instruments

For more information, please contact EPEPS administrator, Mandy Wisehart via 
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.

Sent by
Kara MacGregor
Office Administrator




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[SI-LIST] EPEPS - Call for Papers - Deadline Extended

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