[SI-LIST] EPEPS 2011 - Call for Papers Reminder

  • From: "MacGregor, Kara Lynn" <kmacgreg@xxxxxxxxxxxx>
  • To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Wed, 22 Jun 2011 01:26:49 +0000

Dear Members,
This is a reminder call for papers to submit papers for the 20th Conference on 
Electrical Performance of Electronic Packaging and Systems. The submission 
deadline is 1st July 2011 and details of call for papers and submission can be 
found at the website http://epeps.org<http://epeps.org/>.  The conference is 
held during Oct. 23-26, 2011, in the Silicon Valley, San Jose, CA. Also there 
are great opportunities provided this time for companies to showcase their 
products/brands through structured sponsorships/exhibitions, details of which 
can be found in the exhibits link<http://epeps.ece.illinois.edu/exhibits.html>. 
We look forward to your participation in this premier conference on signal 
integrity, interconnects and electronic packaging.

For more information, please contact EPEPS administrator, Mandy Wisehart via 
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.

Sincerely,
EPEPS Co-Chairs: Ram Achar, Carleton University & Brian Young, Texas Instruments

-----------------------------------------------------------------------------------------------------------------------------------------
20th IEEE International Conference on
Electrical Performance of Electronic Packaging and Systems
EPEPS 2011
October 23-26,     San Jose, CA
Call for Papers
EPEPS (www.epeps.org<http://www.epeps.org/>) is the premier international 
conference on advanced and emerging issues in electrical modeling, analysis, 
synthesis and design of electronic interconnections, packages and systems. It 
also focuses on new methodologies and CAD/design techniques for evaluating and 
ensuring signal, power and thermal integrity in high-speed designs. EPEPS is 
jointly sponsored by the IEEE Components, Packaging and Manufacturing 
Technology Society and IEEE Microwave Theory and Techniques Society. Authors 
are invited to submit papers describing new technical contributions related to 
the broad area of electrical performance of high-speed designs, covering:

  1.  Emerging and advanced issues,
  2.  New design techniques and innovative architectures for design and 
management,
  3.  Novel CAD concepts, methodologies and algorithms for modeling, simulation 
and optimization,

with emphasis on:

  *   System-level, board-level and on-chip interconnects
  *   High-speed channels, links, backplanes, serial and parallel 
interconnects, SerDes
  *   Multiconductor transmission lines
  *   Memory and DDR interfaces
  *   Jitter and noise management
  *   Signal and thermal integrity
  *   Power integrity and power distribution networks (PDNs)
  *   Electronic packages and microsystems
  *   3D interconnects, 3D packages, TSVs and MCMs
  *   Nano interconnects and nano structures
  *   RF/microwave packaging structures, RFICs, mixed signal modules and 
wireless switches
  *   Package-chip co-design
  *   Electromagnetic (EM) and EM interference modeling, simulation algorithms, 
tools and flows
  *   Macromodeling including model order reduction as it applies to electrical 
analysis
  *   Advanced and parallel CAD techniques for signal, power and thermal 
integrity analysis
  *   Measurement and data analysis techniques for system-level and on-chip 
structures.

For a PDF version of the call for papers, please click 
here<http://epeps.ece.illinois.edu/cfp.pdf>

<http://epeps.ece.illinois.edu/cfp.pdf>
Submission Deadline: July 1, 2011, 8pm, PST
Submission Format: 2 column, 4 page, PDF format only.

Information for authors can be found at www.epeps.org<http://www.epeps.org/>. 
Submitted manuscripts should be camera ready and compliant with the general 
standards of the IEEE, including appropriate referencing. Noncompliant 
manuscripts will not be considered for review.
Location: Doubletree Hotel, 2050 Gateway Place, San Jose, CA 95110, USA
Tutorials/Workshops: EPEPS offers tutorials or short courses on 
state-of-the-art topics during the conference.
Sponsorships/Exhibits: EPEPS offers an excellent opportunity for 
sponsorships/exhibits. EPEPS is an exciting forum for vendors to demonstrate 
their state-of-the-art-tools to the attendees. Interested vendors can contact 
the conference administration for more details.
Conference Co-chairs:

  *   Ramachandra Achar, Carleton University :
  *   Brian Young, Texas Instruments


For more information, please contact EPEPS administrator, Mandy Wisehart via 
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.

Sent by
Kara MacGregor
Office Administrator

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