[SI-LIST] Re: Definition of spreading inductance

  • From: Scott McMorrow <scott@xxxxxxxxxxxxx>
  • To: Charles.Grasso@xxxxxxxxxxxx
  • Date: Mon, 23 May 2005 13:38:52 -0400

Charles,
Spreading inductance is just the inductance from point A to point B, 
when the connecting vehicle is a plane or a set of planes.  You can find 
calculations for a specific FPGA power/ground arrangement in papers and 
slides on our site:

at:  http://www.teraspeed.com/publications.html

*/NEW/ - High Performance FPGA Bypass Networks  *

*/NEW/ - Capacitor Placement
*

*
*


Scott McMorrow
Teraspeed Consulting Group LLC
121 North River Drive
Narragansett, RI 02882
(401) 284-1827 Business
(401) 284-1840 Fax

http://www.teraspeed.com

Teraspeed® is the registered service mark of
Teraspeed Consulting Group LLC



Grasso, Charles wrote:

>Hi - Can anyone point me to a concise defensible
>definition of "spreading inductance"?
>
>Thanks!
>
>Best Regards
>Charles Grasso
>Senior Compliance Engineer
>Echostar Communications Corp.
>Tel:  303-706-5467
>Fax: 303-799-6222
>Cell: 303-204-2974
>Pager/Short Message:  3032042974@xxxxxxxx
>Email: charles.grasso@xxxxxxxxxxxx;  
>Email Alternate: chasgrasso@xxxxxxxx
> 
>
>
>-----Original Message-----
>From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
>Behalf Of sunil bharadwaz
>Sent: Monday, May 23, 2005 10:32 AM
>To: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Re: 10-Layer Stack up
>
>
>Thomas ::
>
>Thanks for that input.
>
>Best Regards
>Sunil
>--- Thomas McGonigle <temcgonigle@xxxxxxxxx> wrote:
>
>  
>
>>Sunil,
>>
>>You might want to put the power and ground planes
>>next to each other, making a
>>"sandwich".  This created an embedded bypass
>>capacitor, and also lowers the
>>spreading inductance of the planes, both of which
>>reduce switching noise at
>>high frequencies.  See the Xilinx Virtex-4 PCB
>>Designer's guide, pages 35 to
>>37.  You can find it at : 
>>http://www.xilinx.com/bvdocs/userguides/ug072.pdf
>>
>>
>>--- steve weir <weirsi@xxxxxxxxxx> wrote:
>>    
>>
>>>Sunil, see any of the previous comments about
>>>      
>>>
>>managing cavities.
>>    
>>
>>>Steve.
>>>At 08:09 PM 5/22/2005 -0700, sunil bharadwaz
>>>      
>>>
>>wrote:
>>    
>>
>>>>Hi All ,
>>>>We are trying to design a board  with  FPGA's.
>>>>We are having  two Virtex-4 devices on the
>>>>        
>>>>
>>board.The
>>    
>>
>>>>max intended speed will be 130 Mhz.This is a ten
>>>>layer,50 ohms controlled impedance board.
>>>>The high speed signals have been routed in the
>>>>        
>>>>
>>Layers
>>    
>>
>>>>3,4,7,8.
>>>>We have come up with a  stack up as follows.
>>>>I have also attached the stack up details as a
>>>>        
>>>>
>>word
>>    
>>
>>>>doc.
>>>>
>>>>I'am looking for some
>>>>improvements/concerns/suggestions on the Shown
>>>>        
>>>>
>>stack
>>    
>>
>>>>up.Any feed back  would be highly appreciated.
>>>>
>>>>    Thanks in advance
>>>>
>>>>     Best Regards
>>>>          Sunil
>>>>
>>>>
>>>>0.0325  Copper plating layer 1  5.468 mil trace
>>>>        
>>>>
>>width 50
>>    
>>
>>>>ohms single ended
>>>>0.0175  Copper foil layer 1
>>>>0.0940  Prepreg 1-2
>>>>0.0350  Copper foil layer 2     plane ---GND
>>>>0.1524  Core 2-3
>>>>0.0350  Copper foil layer 3     6.278 mil trace
>>>>        
>>>>
>>width 50
>>    
>>
>>>>ohms single ended
>>>>0.1194  Prepreg 3-4
>>>>0.0350  Copper foil layer 4     6.278 mil trace
>>>>        
>>>>
>>width 50
>>    
>>
>>>>ohms single ended
>>>>0.1524  Core 4-5-6
>>>>0.0350  Copper foil layer 5     plane---Power
>>>>        
>>>>
>>Plane (3.3
>>    
>>
>>>>Volts I/O)
>>>>0.2032  Prepreg 5-6
>>>>0.0350  Copper foil layer 6     plane----GND
>>>>0.1524  Core 6-7
>>>>0.0350  Copper foil layer 7     6.278 mil trace
>>>>        
>>>>
>>width 50
>>    
>>
>>>>ohms single ended .
>>>>0.1194  Prepreg 7-8
>>>>0.0350  Copper foil layer 8     6.278 mil trace
>>>>        
>>>>
>>width 50
>>    
>>
>>>>ohms single ended
>>>>0.1524  Core 8-9
>>>>0.0350  Copper foil layer 9     plane-------
>>>>        
>>>>
>>Power Plane
>>    
>>
>>>>(2.5 Volts split plane )
>>>>0.0940  Prepreg 9-10
>>>>0.0175  Copper foil layer 10
>>>>0.0325  Copper plating layer 10 5.468 mil trace
>>>>        
>>>>
>>width
>>    
>>
>>>>50 ohms single ended
>>>>1.6195  Total PCB thickness in mm
>>>>
>>>>
>>>>
>>>>Yahoo! Mail
>>>>Stay connected, organized, and protected. Take
>>>>        
>>>>
>>the tour:
>>    
>>
>>>>http://tour.mail.yahoo.com/mailtour.html
>>>>
>>>>
>>>>-- Binary/unsupported file stripped by Ecartis --
>>>>-- Type: application/msword
>>>>-- File: stack1.doc
>>>>-- Desc: 354396701-stack1.doc
>>>>
>>>>
>>>>        
>>>>
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>>8305 48 th Avenue
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>>tmcgonigle@xxxxxxxx
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