[SI-LIST] Re: Decoupling capacitors for BGA
- From: Scott McMorrow <scott@xxxxxxxxxxxxx>
- To: mark.alexander@xxxxxxxxxx
- Date: Thu, 07 Sep 2006 17:39:34 -0400
Mark
I was wondering if you ever did update those app notes on PDS design.
Did I miss your SI-List post?
Scott
Scott McMorrow
Teraspeed Consulting Group LLC
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Mark Alexander wrote:
> Kishore, Subbu,
>
> I'll note that XAPP623 is getting a bit out-of-date. For more
> up-to-date information on the latest techniques, check out the PDS
> section of the Virtex-4 User Guide. Though it's not as generic as
> XAPP623 (it applies specifically to the Virtex-4 device family), the
> basic principles it covers apply fairly well to high-speed digital
> devices and PCBs of 2006.
>
> I'm finishing up revisions/updates for both of these documents; will
> make a post to SI-List when the new versions are published.
>
> -mark
>
>
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
> On Behalf Of Kishore Bachu
> Sent: Friday, May 12, 2006 3:48 AM
> To: subramanian1683@xxxxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Decoupling capacitors for BGA
>
> Classification: UNCLASSIFIED
>
> Hi Subramanian,
>
> For your reference, you can find the following article in Xilinx
> website.
> "Power Distribution System (PDS) Design: Using Bypass/Decoupling
> Capacitors"
> Xapp623.pdf
>
> Regards,
> Kishore.
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
> On Behalf Of Subramanian R
> Sent: Friday, May 12, 2006 2:32 PM
> To: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Decoupling capacitors for BGA
>
> Hello All,
> We are using a 0.5mm Pitch 457-Pin BGA Processor. It is running at a
> maximum of 532MHz.
> It has 60 Power pins (Core & I/O)
>
> How do i place the Decoupling capacitors?
>
> Now we have placed all decaps (0402 pack) around the BGA (like an
> island) and connected it to the VCC plane. Should i need to route it to
> the individual pins itself?
>
> The BGA does not have much space between the Balls. So not more than 4-5
> caps can be placed right over the BGA on the other side.
>
> The other thing i can go for is Inter-plane capacitance. But for that
> VCC-GND dielectric should be around 2-3mils, i understand. That doesn't
> look possible with our PCB thickness requirements. It is a 6-layer PCB
>
> Thanks for any suggestions.
>
> Regards
> Subbu
>
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