[SI-LIST] Decoupling capacitor placement
- From: Christopher.Crowley@xxxxxxxxxxxxxxxxx
- To: si-list@xxxxxxxxxxxxx, si-list-bounce@xxxxxxxxxxxxx
- Date: Thu, 29 May 2003 10:24:45 -0400
Hello,
I am looking to add more decoupling to a high pin count BGA and due to
routing
constraints I am unable to get as close as I would like to the device.
Does anyone
have any experience with making one land pad and then soldering a couple
caps
on top of each other to the one land area? Say something like a 0603
.01uf on top of
another 0603 .001uf. I see this as an easy way to get close to the device
as well as reduce
lead and via inductance. Have I missed something electrically fundamental
or are
there production level assembly issues with this method?
Thanks,
Chris
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