Hi All,
i have few question in Decoupling analysis:
The way i am doing Decoupling analysis is "extracting S parameters from the
board for a rail and cascading it with the package S parameters and on die
cap and checking the impedance profile( by plotting Z parameters).
Is it enough or do we need to run the time domain simulations and ensure it
again?
Kindly provide me the process flow various engineers follow.
Regards
Chetan
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field
or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list
For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field
List forum is accessible at:
http://tech.groups.yahoo.com/group/si-list
List archives are viewable at:
//www.freelists.org/archives/si-list
Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu
