[SI-LIST] DESIGNCON 2004 CALL FOR PAPERS

From: "Ozgur Misman" <omism@xxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Mon, 14 Jul 2003 11:41:06 -0700
Dear SI-LIST members,
Please note DESIGNCON 2004 call for papers.

For Designcon 2004, "chip & package codesign"
is added as a new topic category to adress the rapidly growing trend and
need for
chip/package co-design & co-analysis.
Abstract submissions under this new track as well as
others are highly encouraged.


Best Regards,
Ozgur Misman
Amkor Techmology

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=================================================

The International Engineering Consortium is pleased to announce its call
for
papers for DesignCon 2004, the premier educational conference and
technology
exhibition for semiconductor and electronic design engineers.  To view a
list of suggested paper topics and submit an abstract for consideration,
visit the call for papers online at

http://www.designcon.com/conference/callforpapers.asp


Abstract submissions
are due no later than August 29, 2003.

At DesignCon, engineers talk to engineers to find practical solutions to
their most vexing design and verification problems.  Individuals presenting
papers at DesignCon will join an elite group offering unique case studies,
technology innovations, practical techniques, design tips, and application
overviews.

We solicit papers for two types of sessions: technical papers and TecForum
tutorials. Technical papers address design case studies and application
overviews, and are presented in fifty-minute sessions. TecForums are
half-day (three-hour) tutorial sessions, allowing the speakers to cover
their topics in greater depth and breadth.  The technical sessions will be
held on Tuesday, February 3, and Wednesday, February 4; TecForum tutorials
are scheduled for Monday, February 2, and Thursday, February 5.

For more information, you may also contact Barry Sullivan at
+1-312-559-3302
or via e-mail at bsullivan@xxxxxxx
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[SI-LIST] DESIGNCON 2004 CALL FOR PAPERS

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