[SI-LIST] Re: Cross-hatched reference planes
- From: "Ray Anderson" <ray.anderson@xxxxxxxxxx>
- To: <Chris.Cheng@xxxxxxxx>
- Date: Thu, 5 Apr 2007 13:13:28 -0700
Chris Cheng wrote:
"I thought they are called degassing holes. I have yet to see a build up
multi-layer package that doesn't need one."
Chris-
Don't know about all package vendors, but Kinsus requires the degassing
holes in laminate package designs they fabricate whereas Fujitsu's
process doesn't need them.
-Ray
Raymond Anderson
Senior Signal Integrity Staff Engineer
Advanced Platforms Group
Advanced Products Division
Product Technology Department
Package Design Engineering
Xilinx Inc.
2100 Logic Drive
San Jose, California 95124
(408) 626-6277
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