[SI-LIST] Re: Cost Factor of introducing Blind and BuriedVia s
- From: Michael_Greim@xxxxxxxx
- To: istvan.novak@xxxxxxxxxxxxxxxx, AdeelM@xxxxxxxxxxxx,si-list@xxxxxxxxxxxxx
- Date: Wed, 14 Aug 2002 09:29:26 -0500
Hi All,
That is the case for z axis drill vias. However,
if you do a sequential lam blind via approach, you
do have much more flexibility in your depth, but
at a greater cost. Each half of the stack would
be drilled and plated and then the halves put together
and drilled and plated again. However there is
fallout at each step that impacts yields and therefore
cost.
just my 0.02
Michael
-----Original Message-----
From: istvan novak [mailto:istvan.novak@xxxxxxxxxxxxxxxx]
Sent: Tuesday, August 13, 2002 7:25 PM
To: AdeelM@xxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Cost Factor of introducing Blind and Buried Vias
Adeel,
Every board shop may charge a different premium for blind and buried
vias, so eventually the best is to get quotes from the pcb manufacturer
you plan on using. The generic considerations are:
- blind vias do not need extra processing step during lamination, only
the drilling of blind vias after the lamination is done. Therefore blind
vias are adding less cost. But blind vias are limited in aspect ratio
(because of the plating process) and therefore in depth: one to two
layers deep.
- buried vias are between internal layers, but this means an extra
drilling and plating step during lamination at EVERY stackup portion
that carries a different buried via length. As these are through holes
for the plating process, the aspect ratio limitation is not different from
what you may get on the finished board. Because of the several
extra processing steps, buried vias are much more expensive.
Regards
Istvan Novak
SUN Microsystems
----- Original Message -----
From: "Adeel Malik" <AdeelM@xxxxxxxxxxxx>
To: <si-list@xxxxxxxxxxxxx>
Sent: Tuesday, August 13, 2002 7:14 AM
Subject: [SI-LIST] Cost Factor of introducing Blind and Buried Vias
>
> Hi All,
> I am designing a 10-layer board having 6-signal layers and 4
ground
> planes. The baord has 4 BGA1156 Packages as well as QFP208 Packages. Due
to
> the routing denstiy, I have to use many vias which perforate the planes
thus
> enervating the integrity of power and ground planes. I expect the no. of
> through-holes to be about 3000 . Can someone give me the crude
approximation
> that by how much times the cost of the Board will multiply if I introduce
> Blind and Buried Vias ,thus reducing the through-hole vias piercing the
> planes to about 200-300 instaed of 3000.
>
> ADEEL MALIK,
> Design Engineer,
>
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