[SI-LIST] Re: Chassis and Signal ground
- From: "Peterson, James F (FL51)" <james.f.peterson@xxxxxxxxxxxxx>
- To: Jeremy Plunkett <jeremy@xxxxxxxxxxxxxxx>, si-list@xxxxxxxxxxxxx
- Date: Thu, 16 Dec 2004 05:14:16 -0700
Jeremy,
Yes, that's the configuration - and we think the corner is around 300Khz.
Good point - thanks,
Jim
-----Original Message-----
From: Jeremy Plunkett [mailto:jeremy@xxxxxxxxxxxxxxx]
Sent: Wednesday, December 15, 2004 10:51 PM
To: james.f.peterson@xxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: RE: [SI-LIST] Re: Chassis and Signal ground
Jim,
In your existing products do the thermal ground shapes overlap with signal
ground as seen in the board layout(ie topview)? If they do then depending
on the dielectric thickness between them you may already have pretty high
coupling between them at high frequencies due to the plane capacitance. In
this case combining them would only make a difference at DC and low
frequencies where you may find the emi/esd less of a problem.
Jeremy
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