Hi all, I'm beginning a new project and discussing the ground scheme. I'm talking here about a multi board design that will fit into a few U height chassis. There are dozens of ports out of the box (2.5Gb/s each) over copper cable. One of the concepts is connecting all the grounds together (both chassis and digital of the boards and cable connectors). The other method is separation of the chassis and digital grounds with one connection between them (close to the power supply). I'm aware that both methods are used but would like to better understand what are the reasons to choose one way on top of the other? what are the pros and cons of each in terms of EMI? Thanks, -- http://www.fastmail.fm - I mean, what is it about a decent email service? ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu