[SI-LIST] Call for Papers : Special session on "Signal Integrity and Power Integrity" at the 32nd PIERS in Moscow, Russia

  • From: Nitin Kumar CHHABRA <nitin.chhabra@xxxxxx>
  • To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Mon, 2 Apr 2012 13:10:37 +0800

Dear Colleague,
 
                        Greetings !!! I invite you to submit your valuable 
contributions in a special session “Signal Integrity and Power Integrity” at 
Progress In Electromagnetic Research (PIERS), 19 - 23 Aug 2012, Moscow, Russia. 
This session will serve as a platform for knowledge sharing and idea exchange 
among the researchers working in the field of Signal/Power Integrity. The 
topics of the session include (but are not limited to) following :
  
  Signal Integrity analysis.
  Power Integrity analysis.
  Signal/Power integrity Co-Analysis
  High-Speed Interconnects/channels 
  Ground Noise 
  Clock and bus analysis,
  Package modeling
  Power Distribution Networks modeling/extraction.
  Interconnect and substrate modeling/extraction
  Interconnect/Device/Circuit Modeling and Simulation
  Electronic packages. 
  3D technologies for ICs and packages 
  High-frequency and electromagnetic simulation of circuits
  RF, Microwave packaging and mixed signal systems 
  Nano-Interconnects and nano-structures 
  Device modeling/simulation, circuit simulation
  Electromagnetic Theory and Modeling 
  Transmission Line Theory and Modeling 
  Macro-Modeling, reduced-order models 
  Advanced Simulation Tools for Signal and Power Integrity 
  Noise analysis, mixed-signal design considerations.
  Electromagnetic Compatibility 
  Coupling Effects on Interconnects 
  Radiation & Interference 
  Testing & Interconnects 
  Time and Frequency Domain Measurement Techniques. 
  Time domain reflectrometry.
  Jitter modeling and Jitter tolerance/budgeting.
  High Speed serial links Power Spectral Density/EMI/EMC considerations.
  Design for Signal Integrity and Power integrity.
 System level qualification for SI/PI considerations.
 
 
Please submit one page abstract at the following link, in the special session 
“Signal Integrity and Power Integrity by Raj Kumar Nagpal”. 
 
http://piers.org/piers2012Moscow/submit/submit_new.php
 
 
Important Dates
20 April, 2012 --- Abstract Extended Submission Deadline 
20 May, 2012--- Pre-registration Deadline 
30 May, 2012 --- Full-length Paper Submission Deadline 
20 June, 2012 --- Preliminary Program will be available 
10 July, 2012 --- Advance Program will be available 
30 July, 2012 --- Final Program will be available 
 
 
For more details regarding the submission details, symposium venue, 
registration etc., please refer to the symposium website :
 
http://www.piers.org/piers2012Moscow/
 
 
Thank you !
 
With Regards,
Nitin Kumar Chhabra

Session Organizer’s brief intro:
Raj Kumar Nagpal is a Principal Expert at STMicroelectronics, Greater Noida, 
India. He has more than 20 years of industrial experience in Signal 
Integrity/Power Integrity, RF Design and Test. His other interests include 
Conceptual System level modeling to actual model based simulations and test 
characterization of any generic High speed serial 
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