[SI-LIST] Re: Cable grounding scheme

  • From: "Xilei Liu" <xileil@xxxxxxxxxxx>
  • To: erdinih@xxxxxxxxx, chen_jinhua@xxxxxxx
  • Date: Tue, 15 Aug 2006 11:56:13 +0000

Hey, Ihsan,

I've ever seen notes that published in the past in 2002, saying that"we 
learned from NRAO engineers that it is both feasible and advisable to 
physically separate digital circuits from analog systems, and to interpose a 
minimum of two levels of Faraday shielding acting in series." From my point 
of view, it should be easier to employ different EMI solutions for power 
line and signal line separately when the digital/analog grounds are 
separated and connected somehow at a single-point. What will be the problems 
in terms of SI? Welcome your 'fight back' so that I can learn more ;)

Regards,
Celine


>From: "Ihsan Erdin" <erdinih@xxxxxxxxx>
>Reply-To: erdinih@xxxxxxxxx
>To: chen_jinhua@xxxxxxx
>CC: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Re: Cable grounding scheme
>Date: Tue, 15 Aug 2006 06:29:32 -0400
>
>This question makes me wonder if there're any designers left who still
>separate logic ground from the chassis ground in high-speed digital circuit
>design -and on what basis? I thought this whole issue of chassis vs. logic
>ground was something of the past.
>Regards,
>
>Ihsan
>
>On 8/14/06, chen_jinhua@xxxxxxx <chen_jinhua@xxxxxxx> wrote:
> >
> > Hi,
> >
> > I have a few general questions about the high speed cable grounding
> > scheme. It could impact both SI and EMI. I would like to have your
> > inputs about this issue.
> >
> > Scheme 1: cable does not separate logic ground and chassis ground. But
> > when it connects the system/boards, the system/boards have separate
> > logic ground and chassis ground. How do you separate/connect the logic
> > ground to chassis ground in boards? What is the pros and cons for SI
> > and/or EMI?=20
> >
> > Scheme 2: Cable keeps separate logic ground and chassis ground.
> > System/boards also keep the separate logic and chassis ground. Cable
> > logic ground and board logic ground connects, and chassis connects the
> > chassis ground. How do you separate/connect the logic ground to chassis
> > ground in boards? What is the pros and cons for SI and/or EMI?
> >
> > Do you prefer scheme 1 or scheme 2? What is the pros and cons of scheme
> > 1 vs. scheme 2 for SI and/or EMI? Does SI and EMI have conflict
> > requirements?
> >
> > Thanks!
> >
> > Jinhua Chen
> > SI of Hardware Engineering
> > EMC Corp.
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