[SI-LIST] Re: Broadside coupled line vertical registration

  • From: "Dennis Han" <Dennis.Han@xxxxxxxxxxx>
  • To: <billw@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
  • Date: Thu, 5 May 2005 11:20:38 -0500

Does anyone know if any simulator has Monte Carlo or a similar =
statistical
capability?  It would make a task such as this easier.

Dennis


-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] =
On
Behalf Of Bill Wurst
Sent: Thursday, May 05, 2005 10:07 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Broadside coupled line vertical registration


Mark,

While you are evaluating the effects of copper registration, don't=20
forget to also include the effect of manufacturing variations in the=20
thickness of the three dielectrics:  top plane-to-trace, trace-to-trace, =

and bottom plane-to-trace.  Each one will have an impact, the degree of=20
which is dependent upon the relative spacing and the amount of variation =

relative to the nominal thickness, as well as the width of the traces.

Regards,

     -Bill


       /************************************
      /         billw@xxxxxxxxxxx         /
     /                                   /
    / Advanced Electronic Concepts, LLC /
   /           www.aec-lab.com         /
   ************************************
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D
Ed Sayre III wrote:
> Mark,
>    Try using a free ware field solver for this.  It is a simple=20
> experiment
> and you will surprised by the results.
>    We have done some substantial investigations into this and found =
that=20
> the broadside registration is not as sensitive to variations as edge=20
> coupled spacing and dielectric thicknesses.  Of course the issue is =
the=20
> level of coupling for the lines.  The tighter the mutual coupling the =
more

> critical the registration.  Thus try your stack and see.
>=20
> Regards
> -Ed
>=20
>=20
>=20
>=20
> At 02:37 PM 5/5/2005 +0100, Mark Burford wrote:
>=20
>>I have an interesting query, I would like to know what you guru's=20
>>think about the effect of the vertical alignment of a broadside=20
>>coupled trace and the error it could potentially introduce to 2D field =

>>solvers and the traditional transmission line approximation formulas=20
>>for calculating Z0, C and L.  To clarify: a perfect alignment I am=20
>>classing as both lines exactly stacked one above the other with with=20
>>core material in the centre an no over hang, worst case would be one=20
>>line being offset to the left or right by 50 percent.
>>
>>Could the potential error introduced be described to a first order by=20
>>decreasing the capacitance by at worst case 0.5?  What would be the=20
>>2nd order effects?
>>
>>Your thoughts I am sure will be as diverse as they are interesting.
>>
>>Thanks guys
>>
>>Mark Burford=3D20
>>EngD Research Engineer
>>
>>------------------------------------------------------------------
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