[SI-LIST] Re: Board layout issue

  • From: "Ken Cantrell" <Ken.Cantrell@xxxxxxxxxxx>
  • To: <scott@xxxxxxxxxxxxx>, <mmanginella@xxxxxxx>
  • Date: Tue, 16 Jul 2002 08:18:44 -0600

Mike,
I second what Scott said.  If the material you present is germane and
specific to a design issue being discussed, there's not a problem.  Just
know your product and its limitations because someone on the list will
probably know more about it than you do and will call you on it when
marketing hyperbole exceeds empirical data.
Ken

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Scott McMorrow
Sent: Monday, July 15, 2002 7:45 PM
To: mmanginella@xxxxxxx
Cc: ajmani@xxxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Board layout issue



Mike,

Why didn't you just go ahead and say that you are with Syncron
Technologies?  Your posting is a bit deceptive. In your posting you
speak as if you are a helpful third person and not an employee of Syncron.

This group has never had a problem with vendors mentioning that they
have a product which might take care of a particular engineering issue
that is being discussed.

By the way, the layer stackup optimizer does not seem to be mentioned on
your web page.

regards,

scott

--
Scott McMorrow
Teraspeed Consulting Group LLC
2926 SE Yamhill St.
Portland, OR 97214
(503) 239-5536
http://www.teraspeed.com


Mike Manginella wrote:

>There is a company, Syncron Technologies (www.syncrontechnologies.com) that
>has a layer stack up optimizer.  The interesting thing about it is you can
>enter constraints for line and layer impedances as well as other material
>properties and get a good idea of the number of board layers to use.  It is
>constraint driven design for SI.
>
>
>Thanks
>Mike Manginella
>
>----- Original Message -----
>From: "Ravinder Ajmani" <ajmani@xxxxxxxxxx>
>To: <si-list@xxxxxxxxxxxxx>
>Sent: Friday, July 12, 2002 3:48 PM
>Subject: [SI-LIST] Board layout issue
>
>
>
>
>>Hi Layout Gurus,
>>Is there a quick and dirty method to determine if a circuit can be routed
>>on an FR4 board of certain dimension, by taking in to account the
>>
>>
>available
>
>
>>card area and cumulative area of all components.  The card will be about
>>0.8mm thick with six layers (four signal and two power).  I do not have
>>
>>
>the
>
>
>>option to use microvia or any other exotic technology.
>>
>>Your input will be very much appreciated.
>>
>>Regards, Ravinder
>>PCB Development and Design Department
>>IBM Corporation
>>Email: ajmani@xxxxxxxxxx
>>
>>
>>
>***************************************************************************
>
>
>>Always do right.  This will gratify some people and astonish the rest.
>>.... Mark Twain
>>
>>
>>
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--
Scott McMorrow
Teraspeed Consulting Group LLC
2926 SE Yamhill St.
Portland, OR 97214
(503) 239-5536
http://www.teraspeed.com




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