[SI-LIST] Re: Board Layer Material Comparison
- From: "Naveen Reddy" <naveenr@xxxxxxxxxxxxxxx>
- To: <Rick.Baze@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 7 Sep 2004 09:45:24 -0700
There are some issues with using different dielectric materials in a
stack-up; the two materials register differently and this might lead to
yield problems. If the density of glass is different and the stackup is
unbalanced then the PCB is suceptible to bowing as well.
Other than that, its a cost/performance trade off.
-Naveen.
Naveen Reddy
Hardware Engineer
Intellambda Systems
Fremont, CA 95050
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Baze, Rick
Sent: Tuesday, September 07, 2004 8:06 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Board Layer Material Comparison
A 30-layer board we are in process of designing is under discussion of
materials to use and their related advantages and disadvantages. =20
=20
The current design has the top 8 layers using N4000-13 for signal/gnd,
the next 12 layers using GETEK for power/gnd, and the bottom 10 layers
again using N4000-13 for signal/gnd.
=20
The proposed design is all N4000-13 SI. =20
=20
The debate is what advantages/disadvantages there are between the two
designs besides the original design requiring longer, more expensive
processing.
=20
Feedback is greatly appreciated.
=20
Best Regards,
Rick
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=20
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