Hi Ned,
Sorry about the bad link, try this and let me know if you have any further
problems
https://marketing.ansys.com/rc/ansysinc/tp/15219
Sent from my iPhone
On Apr 16, 2015, at 10:42 AM, Dempsher, Ned @ CSG - CSE
<Ned.Dempsher@xxxxxxxxxx> wrote:
Hi David,
This is Ned Dempsher from L-3 Communications in Camden, NJ.
I tried your link in SI list and it does not seem to work.
<http://r20.rs6.net/tn.jsp?e
Do you think that something is being stripped out when it goes to SI LIST or
maybe my secure browser is having trouble?
Thanks,
Ned
Hi all,
We are hosting a free Free Webinar on "Coupled Electromagnetic & Thermal
Analysis of High-speed Printed Circuit Boards"
please join us, for an interesting presentation and Q&A round table. Bring
your questions. Details below:
Register
<http://r20.rs6.net/tn.jsp?e
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~
When evaluating printed circuit board (PCB) designs, engineers must balance
the
requirements of multiple physics disciplines - electrical, thermal and
mechanical
- to produce PCB designs that contribute to long service life and reduced
product
failure.
Join this webinar to examine how ANSYS multiphysics simulation allows
engineers
to analyze the overall reliability of a printed circuit board, simulating
individual
physical phenomena as well as the interaction between physics disciplines
to improve
overall product performance. Learn how power- and signal-integrity analysis
can
minimize crosstalk and evaluate the board's power integrity; how thermal
simulation
can evaluate board temperatures and ensure that the device operates within
an allowable
temperature range; and how thermal−stress simulation can guarantee
mechanical
reliability.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~
Coupled Electromagnetic & Thermal Analysis
of High-speed Printed Circuit Boards
Thursday, May 7, 2015
2:00 PM EDT, 6:00 PM GMT
Duration: 60 minutes with live Q & A
Register
<http://r20.rs6.net/tn.jsp?e
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
~~~~~~~~~~~~~~~~~~~~
Best,
David Vye
Business Development Manager, ANSYS Inc.
Work: 781.743.0622
Mobile: 978.884.2971
Twitter: @EM_Sim_Biz <https://twitter.com/EM_Sim_Biz>
Receive my updates on upcoming events: Electronic Simulation Updates
<http://visitor.r20.constantcontact.com/manage/optin?v
