[SI-LIST] AW: Multi-Giga-Hertz Rigid-Flex Feasibility
- From: Karsten Drögemüller <k.droegemueller@xxxxxxxxx>
- To: "'Hirshtal Itzhak'" <ihirshtal@xxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 24 Nov 2009 15:07:11 +0100
Hello Itzhak,
it is possible to design and manufacture a rigid-flex floil circuit for a
differential pair of 3.125GHz and even higher data rates.
Due to the small thickness of the flex foil the traces are small in width
which can cause tolerance problems. Check different vendors.
Best regards
Karsten Droegemueller
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Von: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] Im
Auftrag von Hirshtal Itzhak
Gesendet: Dienstag, 24. November 2009 14:21
An: si-list@xxxxxxxxxxxxx
Betreff: [SI-LIST] Multi-Giga-Hertz Rigid-Flex Feasibility
Hello All
My project manager intends to use a rigid-flex design in our next
high-speed board.
He wants to route a few pairs of 3.125GHz from a rigid section to
another one through a flex section.
Does anyone know if this is feasible? I found out that the 2 sections,
although spec'd to be 100-Ohm diff impedance, can still differ
substantially - as much as 30%, because the tolerance of the flex
section is +/-20%. Can such a design work for a substantial trace
length? Should I restrict the trace length on the flex section to be no
more than an inch or so, in order to reduce the impact of the supposed
non-uniform impedance?
I intend to use a 2-layer flexible laminate with the pairs on one layer
and a Ground reference on the other one.
Any advice on this matter would be helpful
Thanks
Itzhak hirshtal
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