Dear all, I have 2 questions 1) We are planning to use 8 layer PCB for high speed circuit having max 1.5GHz clock frequency. Which stackup do you recommend? First Stackup: Signal Ground Signal Signal (includes a few power islands) Power (includes ground island for 4th layers' high speed signals' return path) Signal Ground Signal OR Second Stackup: Signal Ground Signal Ground Power Signal Ground Signal Second choice seems good but very hard for routing, Do you think it worths to try second choice? Which is the best stack up for 8 layer PCB for good Signal integrity and EMC performance? 2) Can we say that if any stackup is the best for Signal Integrtiy, it is also the best for EMC? or reverse? Thanks for your interest Regards Mustafa ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu