[SI-LIST] 2014 IEEE International Conference on Signal and Power Integrity (SIPI 2014)
- From: "Fan, Jun" <jfan@xxxxxxx>
- To: "'si-list@xxxxxxxxxxxxx'" <si-list@xxxxxxxxxxxxx>
- Date: Thu, 19 Sep 2013 18:02:43 +0000
Dear SI-List subscribers,
For the first time, we will have an IEEE International Conference on Signal and
Power Integrity (SIPI 2014), embedded within the 2014 IEEE International
Symposium on Electromagnetic Compatibility! Registered conference attendees
will have access to SIPI 2014, as well as the entire EMC Symposium program,
without additional fees. Meanwhile, conference proceedings will be submitted
for posting to IEEE Xplore. Furthermore, authors of accepted papers will be
invited to submit an extended version of their symposium paper for possible
publication in a special issue of the IEEE Transactions on Electromagnetic
Compatibility. Proposals for special sessions, workshops, tutorials, and
experiments are also encouraged.
* Dates: 4 - 8 August 2014
* Location: Raleigh Convention Center, Raleigh, NC, USA
Please refer to
http://emc2014.org/assets/files/SIPI_8.5x11_call4papers_lores.pdf<http://www.linkedin.com/redirect?url=http%3A%2F%2Femc2014%2Eorg%2Fassets%2Ffiles%2FSIPI_8%2E5x11_call4papers_lores%2Epdf&urlhash=xWOW&_t=tracking_anet>
for more details about paper submission including topics. Here is a quick
summary of information for authors:
Author Submission Schedule
* Optional abstract submission: open NOW at
http://emc-center.org/OptionalAbstractSubmissionforSIPI2014.aspx<http://www.linkedin.com/redirect?url=http%3A%2F%2Femc-center%2Eorg%2FOptionalAbstractSubmissionforSIPI2014%2Easpx&urlhash=hVaB&_t=tracking_anet>.
* Full Paper Manuscript: November 1, 2013 - January 20, 2014.
* Acceptance Notification: March 10, 2014
* Final Paper and Workshop/Tutorial Material Due: May 9, 2014
Student Paper Contest
As a part of the EMC symposium, graduate and undergraduate authors are eligible
for the Symposium Best Student Paper contest. The student must be the primary
author and should indicate that they wish to be considered for the contest when
submitting the preliminary manuscript. Each student's professor will be asked
to certify that the paper is primarily the work of the student.
Special Issue of IEEE Transactions on EMC
Authors of accepted papers will be invited to submit an extended version of
their conference paper for possible inclusion in a special issue of the IEEE
Transactions on Electromagnetic Compatibility featuring papers from the 2014
IEEE International Symposium on EMC including SIPI 2014. These submissions will
be subjected to the same rigorous review as papers submitted for publication in
regular issues of the IEEE Transactions on EMC.
Guidelines for Authors & Submittal Procedures
Prospective authors must submit electronically**.
* A full manuscript (4 - 6 pages) including all relevant results and
conclusions.
* Choice of presentation format (traditional oral or open forum).
Here is a template of manuscript
http://emc2013.org/assets/files/IEEE_Paper_Word_Template_LETTER_V3.zip<http://www.linkedin.com/redirect?url=http%3A%2F%2Femc2013%2Eorg%2Fassets%2Ffiles%2FIEEE_Paper_Word_Template_LETTER_V3%2Ezip&urlhash=q0We&_t=tracking_anet>.
** The full-paper submission website will not open until November 1, 2013.
Check back with the conference web site
(http://www.emc2014.org/SIPI2014/<http://www.linkedin.com/redirect?url=http%3A%2F%2Fwww%2Eemc2014%2Eorg%2FSIPI2014%2F&urlhash=4RCq&_t=tracking_anet>)
for updates on the paper submission process. During the electronic submission
process a unique author code is created for tracking purposes. Submissions are
reviewed anonymously so please do not include author names or affiliations on
the Preliminary Manuscript. Failure to comply with submission requirements may
result in rejection.
Optional abstract submission
To increase the chance of paper acceptance, authors have an option to submit an
abstract now to
http://emc-center.org/OptionalAbstractSubmissionforSIPI2014.aspx<http://www.linkedin.com/redirect?url=http%3A%2F%2Femc-center%2Eorg%2FOptionalAbstractSubmissionforSIPI2014%2Easpx&urlhash=hVaB&_t=tracking_anet>.
(Note this site is different than the official paper submission site).
Although final acceptance depends on the full manuscript, the technical
committee will review the abstracts, provide an initial assessment of paper
quality, and offer suggestions to improve the paper.
SIPI 2014 General Chair Jun Fan (Jun.Fan@xxxxxxxx)
SIPI 2014 Technical Program Co-Chairs
Dale Becker (wbecker@xxxxxxxxxx); Xiaoning Ye (xiaoning.ye@xxxxxxxxx)
***********************************
Dr. Jun Fan
Associate Professor
Department of Electrical and Computer Engineering
Missouri University of Science and Technology
MO 65409
Tel: 573-341-6069
Email: jfan@xxxxxxx
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