[SI-LIST] 2014 EPEPS – Deadline extended for paper submission
- From: EPEPS Admin <epeps-admin@xxxxxxxxxxxx>
- To: "'si-list@xxxxxxxxxxxxx'" <si-list@xxxxxxxxxxxxx>
- Date: Wed, 2 Jul 2014 21:05:10 +0000
Dear Members,
The call for papers for the 23rd Conference on Electrical Performance of
Electronic Packaging and Systems submission deadline has been extended to July
14, 2014. The submission process can be found at epeps.org<http://epeps.org/>
and can also be accessed through the link Call for
Papers<http://epeps.ece.illinois.edu/2014callforpapersepeps.pdf>. The
conference is held during Oct. 26-29, 2014, in Portland, Oregon. Also there are
great opportunities provided for companies to showcase their products/brands
through structured sponsorships/exhibitions, details of which can be found in
the link Sponsorship
Packages<http://epeps.ece.illinois.edu/2014_Sponsorship_Packages.pdf>. We look
forward to your participation in this premier conference on signal integrity,
interconnects and electronic packaging.
For more information, please contact EPEPS administrator, Mandy Wisehart via
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.
Sincerely,
EPEPS Co-Chairs: Dale Becker, IBM, and Jose Schutt-Aine, University of Illinois
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