Dear Members, The call for papers for the 22nd Conference on Electrical Performance of Electronic Packaging and Systems is posted at our website epeps.org<http://epeps.org> and can be accessed through the link 2013 EPEPS- Call for Papers<http://epeps.ece.illinois.edu/2013%20call_for_papers_epeps.pdf>. The conference is held during Oct. 27-30, 2013, in San Jose, CA. The deadline for submission of manuscripts is July 01, 2013. Also there are great opportunities provided for companies to showcase their products/brands through structured sponsorships/exhibitions, details of which can be found in the exhibits link Sponsor/Exhibitor Opportunities<http://epeps.ece.illinois.edu/2013%20Sponsorship.pdf> . We look forward to your participation in this premier conference on signal integrity, interconnects and electronic packaging. For more information, please contact EPEPS administrator, Mandy Wisehart via email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>. Sincerely, EPEPS Co-Chairs: Kathleen Melde, University of Arizona, and Vikram Jandhyala, University of Washington ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu