[SI-LIST] 0201 Components

From: pwelling@xxxxxxxxxxxxxx
To: si-list@xxxxxxxxxxxxx
Date: Wed, 10 Apr 2002 14:42:25 -0600

Hi all,

Have any of you placed 0201 components (decoupling, termination, etc) under
BGAs or in arrays?

How close have simulation vs measured performance matched?

Have you experience any manufacturing issues with this like:
1) Solder fillet issues with additional component thermal mass
2) Component damage due to thermal mass during assembly
3) Reliability due to thermal cycling of BGA / PWB - cracking components,
etc
4) Issues with blind vias or microvias
5) Crosstalk of 0201 components in termination arrays or decoupling core vs
I/O voltages
6) Any other issues?

Edge rates are forcing shorter termination stub lengths. 

Any recommendations?

Thanks,

Philip Ross Wellington
Mgr. Signal Integrity & EMI
L-3 Communications CSW

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[SI-LIST] 0201 Components

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