[PCB_FORUM] Re: regarding blind/buried
- From: "Hamid Awais" <hawais@xxxxxxxxxxxxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Fri, 12 May 2006 14:51:21 +0500
Thanks for the valuable information.
-----Original Message-----
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx]
Sent: Thursday, May 11, 2006 11:51 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: regarding blind/buried
Hello Hamid,
Yes, you can microvia down to layer 2 (gnd plane). You
can use a micro-via or micro-via in pad, typically
one layer down is a 14-16 mil pad, 4-6 mil drill.
Also, you can micro-via down to layer 3, however, the
micro-via will be somewhere around 18-20 pad with 10-12 drill.
The board I am currently designing has the following:
Layer 1 - Layer 2 = Microvia in BGA pad, 16 pad, 4 mil drill
Layer 2 - Layer 7 = Buried via, 20 mil pad, 12 mil drill, 28 antipad.
Layer 8 - Layer 13 = same as L2 - L7
Layer 13 - Layer 14 = Same as L1 - L2.
Stephen
-----Original Message-----
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Hamid Awais
Sent: Thursday, May 11, 2006 3:34 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] regarding blind/buried
Hello all:
I have a question here regarding the stack up for blind/buried boards.
Is this necessary to have ROUTING layer adjacent to Top and Bottom
layers or
we may have Planes (negative) layers adjacent to Top/Bottom and then a
positive routing layer.
In case we have planes layer adjacent to TOP, then the TOP-Blind via
must be
like from TOP->Plane->Signal layer, right?
Looking forward to some expert opinion.
Cheers,
Hamid.
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