Hi, Thanks for ur reply... In my design i am using 0.5 mm pitch BGA. I am using 5 mil drill via. I am using Blind Buried vias also. is it possible to manufacture in INDIA....? On Tue, Jul 7, 2009 at 2:15 PM, Ramachandra KG <ramachandra.kg@xxxxxxxxx>wrote: > well, > question again now is whether you want those via holes filled with > conductive or non-conductive epoxy? or you just want to leave it as it is... > > Yes, Hi-Q can do via on pad, but they have a limit on drill size of 8 mils. > So if your BGA is 0.5mm and you are planning to go for via in pad, i guess > it might not work for u. > > On Tue, Jul 7, 2009 at 1:57 PM, Maqbool, Mashak (GE Infra, Energy) < > mashak.maqbool@xxxxxx> wrote: > >> Hi, >> >> Yes HI-Q Electronics Bangalore does that. >> >> Regards, >> Mashak >> >> ------------------------------ >> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto: >> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel >> *Sent:* Tuesday, July 07, 2009 1:52 PM >> *To:* icu-pcb-forum@xxxxxxxxxxxxx >> *Subject:* [PCB_FORUM] Re: Via-in-Pad >> >> Hi, >> Is there any manufacturer in *INDIA* who is having the capability >> to manufacture Via in Pad Design.........? >> >> >> On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote: >> >>> >>> Via in Pad may reduce the number of layers required to accomplish the >>> dense routing. It can also reduce the via discontinuity presented in the >>> breakout region. >>> >>> Via in pad however, increases the manufacturing cost as all the >>> manufacturer do not have that capability. >>> >>> Usually via in pad may be an essential requirement if your BGA pitch is >>> 0.5 mm or less. If the BGA pitch is 0.65 mm or larger you may not need Via >>> in pad. >>> >>> You may like to see the book - "Signal Integrity for PCB Designers", by >>> Vikas Shukla available at Amazon. >>> >>> If you want more information you may search for the relevant expert at >>> http://ezdia.com and ask the question to the expert. >>> >>> >>> --- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote: >>> >>> > From: karthik r <pcbtech4me@xxxxxxxxx> >>> > Subject: [PCB_FORUM] Via-in-Pad >>> > To: icu-pcb-forum@xxxxxxxxxxxxx >>> > Date: Saturday, July 4, 2009, 5:35 AM >>> > Hi all, >>> > >>> > Can someone explain me the advantages & >>> > dis-advantages in using a Via-in-Pad technique, both design >>> > & manufacturing perspective. >>> > >>> > Also the points to be taken care while doing so. >>> > >>> > Thanks in advance !!!! >>> > >>> > Regards, >>> > Karthik >>> > >>> >>> >>> >>> ----------------------------------------------------------- >>> To subscribe/unsubscribe: >>> Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx >>> with a subject of subscribe or unsubscribe >>> >>> To view the archives of this list go to >>> //www.freelists.org/archives/icu-pcb-forum/ >>> >>> Problems or Questions: >>> Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx >>> ----------------------------------------------------------- >>> >> >> >> >> -- >> REGARDS >> >> S.Sakthivel >> >> I'm not the best >> but I'm not like the rest >> > > -- REGARDS S.Sakthivel I'm not the best but I'm not like the rest