[PCB_FORUM] Re: Via-in-Pad
- From: Ramachandra KG <ramachandra.kg@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Tue, 7 Jul 2009 14:15:16 +0530
well,
question again now is whether you want those via holes filled with
conductive or non-conductive epoxy? or you just want to leave it as it is...
Yes, Hi-Q can do via on pad, but they have a limit on drill size of 8 mils.
So if your BGA is 0.5mm and you are planning to go for via in pad, i guess
it might not work for u.
On Tue, Jul 7, 2009 at 1:57 PM, Maqbool, Mashak (GE Infra, Energy) <
mashak.maqbool@xxxxxx> wrote:
> Hi,
>
> Yes HI-Q Electronics Bangalore does that.
>
> Regards,
> Mashak
>
> ------------------------------
> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel
> *Sent:* Tuesday, July 07, 2009 1:52 PM
> *To:* icu-pcb-forum@xxxxxxxxxxxxx
> *Subject:* [PCB_FORUM] Re: Via-in-Pad
>
> Hi,
> Is there any manufacturer in *INDIA* who is having the capability to
> manufacture Via in Pad Design.........?
>
>
> On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote:
>
>>
>> Via in Pad may reduce the number of layers required to accomplish the
>> dense routing. It can also reduce the via discontinuity presented in the
>> breakout region.
>>
>> Via in pad however, increases the manufacturing cost as all the
>> manufacturer do not have that capability.
>>
>> Usually via in pad may be an essential requirement if your BGA pitch is
>> 0.5 mm or less. If the BGA pitch is 0.65 mm or larger you may not need Via
>> in pad.
>>
>> You may like to see the book - "Signal Integrity for PCB Designers", by
>> Vikas Shukla available at Amazon.
>>
>> If you want more information you may search for the relevant expert at
>> http://ezdia.com and ask the question to the expert.
>>
>>
>> --- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote:
>>
>> > From: karthik r <pcbtech4me@xxxxxxxxx>
>> > Subject: [PCB_FORUM] Via-in-Pad
>> > To: icu-pcb-forum@xxxxxxxxxxxxx
>> > Date: Saturday, July 4, 2009, 5:35 AM
>> > Hi all,
>> >
>> > Can someone explain me the advantages &
>> > dis-advantages in using a Via-in-Pad technique, both design
>> > & manufacturing perspective.
>> >
>> > Also the points to be taken care while doing so.
>> >
>> > Thanks in advance !!!!
>> >
>> > Regards,
>> > Karthik
>> >
>>
>>
>>
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>
>
>
> --
> REGARDS
>
> S.Sakthivel
>
> I'm not the best
> but I'm not like the rest
>
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