[PCB_FORUM] Re: Via-in-Pad
- From: "Maqbool, Mashak (GE Infra, Energy)" <mashak.maqbool@xxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Tue, 7 Jul 2009 13:57:04 +0530
Hi,
Yes HI-Q Electronics Bangalore does that.
Regards,
Mashak
________________________________
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Sakthivel
Sent: Tuesday, July 07, 2009 1:52 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Via-in-Pad
Hi,
Is there any manufacturer in INDIA who is having the capability to
manufacture Via in Pad Design.........?
On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote:
Via in Pad may reduce the number of layers required to
accomplish the dense routing. It can also reduce the via discontinuity
presented in the breakout region.
Via in pad however, increases the manufacturing cost as all the
manufacturer do not have that capability.
Usually via in pad may be an essential requirement if your BGA
pitch is 0.5 mm or less. If the BGA pitch is 0.65 mm or larger you may
not need Via in pad.
You may like to see the book - "Signal Integrity for PCB
Designers", by Vikas Shukla available at Amazon.
If you want more information you may search for the relevant
expert at http://ezdia.com and ask the question to the expert.
--- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote:
> From: karthik r <pcbtech4me@xxxxxxxxx>
> Subject: [PCB_FORUM] Via-in-Pad
> To: icu-pcb-forum@xxxxxxxxxxxxx
> Date: Saturday, July 4, 2009, 5:35 AM
> Hi all,
>
> Can someone explain me the advantages &
> dis-advantages in using a Via-in-Pad technique, both design
> & manufacturing perspective.
>
> Also the points to be taken care while doing so.
>
> Thanks in advance !!!!
>
> Regards,
> Karthik
>
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--
REGARDS
S.Sakthivel
I'm not the best
but I'm not like the rest
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