[PCB_FORUM] Re: Via Size

  • From: Bob McCreight <bobmccr8@xxxxxxxxx>
  • To: ameehan@xxxxxxxxxxxxxx, icu-pcb-forum@xxxxxxxxxxxxx
  • Date: Thu, 26 Jul 2012 09:25:18 -0700 (PDT)

Hi Alexis,
What about using a soldermask defined opening? You could increase the pad size 
for the annular ring aspect but use the soldermask to limit the solder area to 
11mils. Just a thought.
Bob McCreight

--- On Thu, 7/26/12, ameehan@xxxxxxxxxxxxxx <ameehan@xxxxxxxxxxxxxx> wrote:

From: ameehan@xxxxxxxxxxxxxx <ameehan@xxxxxxxxxxxxxx>
Subject: [PCB_FORUM] Via Size
To: "ICU" <icu-pcb-forum@xxxxxxxxxxxxx>
Date: Thursday, July 26, 2012, 9:15 AM

#yiv967566037 body{font-family:Geneva, Arial, Helvetica, 
sans-serif;font-size:9pt;background-color:#ffffff;color:black;}Good morning 
group!
We’re working on a design that has several .5mm pin pitch
BGA’s. In order to route it, we’ll have to use via-in-pad technology (and maybe
even blind vias). The mounting pad is only 11 mils dia (.28mm), and the board 
is 50 mils (1.27mm) thick. Our smallest via currently has a 6 mil hole, but 
that won’t leave enough annular ring with a 11 mil pad. What have you folks 
used for this type of part? I've also forwarded the question to our fab houses 
to get their feedback, but wanted to know what your experience has been. Thanks.

Alexis Meehan
Violin Memory Inc



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