[ibis] IBIS Summit at EDI CON 2017 - Fourth Call for Presentations and Participation
- From: Mike LaBonte <mlabonte@xxxxxxxxxx>
- To: <ibis@xxxxxxxxxxxxx>, <ibis-users@xxxxxxxxxxxxx>
- Date: Sat, 26 Aug 2017 22:33:05 -0400 (EDT)
IBIS Summit at EDICON USA 2017
Fourth Call for Participation and Presentations
The IBIS Open Forum is holding its first IBIS Summit Meeting following
EDICON USA 2017, on Wednesday, September 13, 2017 in Boston,
Massachusetts. We encourage IBIS Summit participants to also attend EDICON
USA 2017 <http://www.ediconusa.org/> , taking advantage of the 60%
discount code below. EDICON is offering lunch to those registered for both
the IBIS summit and the EDICON exhibits.
IBIS Summits are designed to enable face-to-face interactions between
model users, model makers and tool developers in the IBIS community. Those
people interested in presenting at or in attending the event may register
using the information below.
Some sponsors are listed, but we welcome additional sponsors to cover the
meeting expenses.
EDICON participants are welcome to attend this Summit, but we urge
everyone to register for planning purposes.
We look forward to seeing you in Boston!
Mike LaBonte, SiSoft
Chair, IBIS Open Forum
_____
IBIS Summit at EDICON USA 2017
Fourth Call for Participation and Presentations
_____
IBIS SUMMIT:
September 13, 2017 13:00-17:00
ROOM:
104
LOCATION:
Hynes Convention Center
900 Boylston St
Boston, MA 02115
Ph: +1-617-954-2000
SPONSORS:
SiSoft
Teraspeed Labs
If your company is interested in sponsoring this event, please contact
Mike LaBonte (mlabonte@xxxxxxxxxx <mailto:mlabonte@xxxxxxxxxx> )
CONTENT:
Presentations, and Discussions
PURPOSE:
Solicit and Exchange IBIS Model Related Information and Ideas
EDICONUSA 2017:
September 11-13, 2017
EDICONUSA URL:
http://www.ediconusa.org/
_____
_____
BACKGROUND
This meeting will be conducted as a formal IBIS Summit meeting.
Presentations are expected to be publicly distributable and will be
archived in an electronic format. Presentations will be reviewed by the
IBIS Open Forum Board for appropriateness before being accepted. Minutes
of the meeting will be issued.
The meeting is FREE and OPEN to everyone. Breaks with refreshments are
planned.
CALL FOR PARTICIPANTS
People involved in IBIS Model development, EDA tool development, and
digital circuit design are invited to participate. If you want to
participate, please register with the information below:
Name:
E-mail address:
Company:
Send to:
Lance Wang (lwang@xxxxxxxxxx <mailto:lwang@xxxxxxxxxx> )
Deadline:
September 6, 2017
CALL FOR PRESENTATIONS
We are seeking presentations from individuals who have IBIS experiences or
issues. Some suggested subjects of interest are:
* IBIS Model Development Experiences
* Company IBIS Standards and Requirements
* Generating & Validating IBIS Models
* Future IBIS Developments and Requirements (e.g., IBIS-AMI)
* Modeling of dedicated technology issues (e.g., connectors, and
very high speed interfaces)
* EMC/EMI and Power Integrity Issues
* Related modeling issues (e.g., SPICE, S-Parameter modeling)
* Experiences using IBIS in the PCB Design process
Electronic Archival:
* We require electronic versions so they can be projected, archived,
and made available to non-attendees.
* We prefer Microsoft PowerPoint* or Adobe PDF*.
* Please send presentations for processing and brief review.
If you plan a presentation, please supply:
Title:
Presenter:
E-mail address:
Company:
Estimated Time Required:
Send this to:
Bob Ross (bob@xxxxxxxxxxxxxxxxx <mailto:bob@xxxxxxxxxxxxxxxxx> )
Deadline:
August 30, 2017
Note, Vendor-specific or product promotional material is forbidden at IBIS
Summits. Presentations must be submitted by the deadline for review. The
IBIS Open Forum reserves the right to stop or reject a scheduled
presentation that has not been reviewed.
AGENDA
The agenda includes presentations, discussions, breaks and refreshments. A
complete agenda will be posted one week before the event.
Tentative Presentations:
Chairs Report
SiSoft
Signal Integrity Methodology for Double-Digit Multi-Gigabit Interface
Cadence Design Systems
Interconnect Modeling Using IBIS-ISS and Touchstone
Intel Corp.
Technical Discussion on IBIS and Interconnect Topics
Other Topics TBD
C Copyright 2017 IBIS Open Forum
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