[ibis] EPEPS 2017 IBIS Summit - Fourth Call for Participation and Presentations
- From: "Bob Ross" <bob@xxxxxxxxxxxxxxxxx>
- To: <ibis-users@xxxxxxxxxxxxx>, <ibis@xxxxxxxxxxxxx>
- Date: Wed, 27 Sep 2017 20:07:17 -0700
IBIS_logo
EPEPS 2017 IBIS Summit Meeting
Fourth Call for Participation and Presentations
The IBIS Open Forum is pleased to announce our IBIS Summit meeting at EPEPS
2017 <http://epeps.org/> . The Summit will be held in Santa Jose,
California, during the afternoon of Wednesday, October 18, 2017.
Some sponsors are listed, but we welcome additional sponsors to cover the
meeting expenses. Some tentative titles and topics are listed in the
Announcement.
EPEPS participants are welcome to attend this Summit, but we urge everyone
to register for planning purposes.
We look forward to seeing you in San Jose!
Mike LaBonte, SiSoft
Chair, IBIS Open Forum
_____
EPEPS 2017 IBIS Summit meeting
Fourth Call for Participation and Presentations
_____
IBIS SUMMIT:
Wednesday, October 18, 2017, 1:00 PM to 6:00 PM
LOCATION:
DoubleTree by Hilton Hotel
2050 Gateway Place
San Jose, California
http://www.epeps.org/venue.html
ROOM:
Monterey
CONTENT:
Presentations and Discussions
COST:
Free
PRIMARY SPONSORS:
EPEPS 2017
IBIS Open Forum
SPONSORS:
Keysight Technologies
Synopsys
Others TBD
We are seeking more co-sponsors. The benefits to sponsors include
recognition at the meeting and acknowledgement in the Calls for papers and
meeting minutes.
Your financial support strengthens the organization by allowing to focus
resources on industry activities rather than raising money. Your
organization will receive generous thanks and public acknowledgement for
your support.
Please contact Mike LaBonte (mlabonte@xxxxxxxxxx) for co-sponsorship
information.
CO-LOCATED CONFERENCE:
26th Conference on EPEPS 2017
(Electrical Performance of Electronic Packaging and Systems)
DATES:
Sunday - Wednesday, October 15 - 18, 2017
EPEPS 2017 URL:
http://www.epeps.org/
BACKGROUND
EPEPS is the premier annual USA event for electronic packaging,
interconnect, systems, and modeling. Topics of current interest to the IBIS
Open Forum are addressed at EPEPS.
The EPEPS IBIS Summit meeting will be conducted as a formal IBIS meeting.
Presentations are expected to be available in an electronic format, and
minutes of the meeting will be issued.
The meeting is FREE and OPEN to everyone. A break with refreshments is
planned.
CALL FOR PARTICIPANTS
People involved in IBIS Model development, EDA tool development, and digital
circuit design are invited to participate. If you want to participate,
please register with the information below:
Name:
E-mail address:
Company:
Send to:
Mike LaBonte (mlabonte@xxxxxxxxxx)
Deadline:
October 16, 2017
CALL FOR PRESENTATIONS
We are seeking presentations from individuals who have experiences of
interest to the IBIS modeling community. These can include, but are not
limited to:
* Demonstrations of modeling techniques
* Experiences using IBIS in the PCB Design process
* Company IBIS Standards and Requirements
* Explanations of behavioral algorithms
* Descriptions of difficulties encountered
* Model correlation
* Modeling building experiences
* Comparisons to other modeling methods
* New technologies for modeling buffers and components
* New technologies for modeling packaging and interconnects
* Related modeling issues (e.g., SPICE, S-Parameter modeling)
* IBIS-AMI topics
* Algorithmic modeling topics
* EMC/EMI and Power Integrity Issues
Presentations may be addressed to any and all levels of IBIS experience,
from beginner to expert.
Presentation Format:
Microsoft PowerPoint* or Adobe Acrobat* electronic formats are favored and
will be pre-loaded on a Microsoft Windows*-based meeting laptop prior to the
meeting. Materials will be projected. Handouts or other physical media are
welcome but must be provided by the presenter (20 copies)
Time: Usually 15-45 minutes (allow time for questions and discussion)
Electronic Archival:
Presentations will be archived under the IBIS Summit website.
If you plan a presentation, please supply:
Title:
Presenter:
E-mail address:
Company:
Estimated Time Required:
Send this to:
Bob Ross (bob@xxxxxxxxxxxxxxxxx)
Deadline:
Friday, October 6, 2017
All submissions will be reviewed by the IBIS Board and are subject to
approval before the presentation scheduled at the Summit.
Note, Vendor-specific or product promotional material is forbidden at IBIS
Summits. Presentations must be submitted by the deadline for review. The
IBIS Open Forum reserves the right to stop or reject a scheduled
presentation that has not been reviewed.
AGENDA
The agenda includes presentations, discussions, breaks and refreshments. A
complete agenda will be posted one week before the event.
Tentative Topics and Presentations:
. Keynote - "Go Big or Go Home", Tom Lee, Stanford University
. IBIS Update, Mike LaBonte, SiSoft
. "IBIS-AMI Modeling Using Scripts and Spice Models", Wei-hsing
Huang, SPISim
. BIRD189 Interconnect Modeling Proposal Update topics
. Other Topics TBD
HOTEL AND TRANSPORTATION INFORMATION
Hotel Venue:
http://www.epeps.org/venue.html
C Copyright 2017 IBIS Open Forum
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