[ibis] DesignCon 2018 IBIS Summit - Third Announcement
- From: Mike LaBonte <mlabonte@xxxxxxxxxx>
- To: <ibis@xxxxxxxxxxxxx>, <ibis-users@xxxxxxxxxxxxx>
- Date: Fri, 12 Jan 2018 15:33:51 -0500 (EST)
IBIS Summit at DesignCon 2018
Third Call for Participation and Presentations
The IBIS Open Forum is pleased to announce our IBIS Summit meeting at
DesignCon 2018. The Summit will be held in Santa Clara, California, on
Friday, February 2, 2018.
NOTE: The IBIS summit takes place after the last day of DesignCon. Please
consider this in your travel plans.
IBIS Summits are designed to enable face-to-face interactions between
model users, model makers and EDA tool developers in the IBIS community.
Those interested in presenting at or in attending the event may register
using the information below. We also encourage the IBIS community to
register for DesignCon <https://designcon.tech.ubm.com/2018> using the
20% promo code "IBIS" (see below).
The IBIS Open Forum is sponsoring the event, but we welcome additional
sponsors to cover some of the meeting expenses, including the FREE lunch
and refreshments.
Special note: The tentative list of presentation topics below includes
Keynote Speaker Thomas Lee!
We look forward to seeing you in Santa Clara!
Mike LaBonte
Chair, IBIS Open Forum
_____
IBIS Summit at DesignCon 2018
Third Call for Participation and Presentations
_____
IBIS SUMMIT:
Friday, February 2, 2018 8:00 AM to 5:00 PM
ROOM:
209
LOCATION:
Santa Clara Convention Center
5101 Great America Parkway
Santa Clara, California 95054
CONTENT:
Presentations and Discussions
COST:
FREE
ORGANIZATIONAL
SPONSORS:
IBIS Open Forum
UBM
SPONSORS:
Keysight Technologies
Mentor, a Siemens Business
We are seeking more co-sponsors. The benefits to sponsors include
recognition at the meeting and acknowledgment in the calls for
participation and presentations. Your financial support strengthens the
organization by allowing IBIS to focus resources on industry activities
rather than raising money. You will receive generous thanks and public
acknowledgment for your support.
Please contact Mike LaBonte (mlabonte@xxxxxxxxxx
<mailto:mlabonte@xxxxxxxxxx> ) for co-sponsorship information.
_____
<https://designcon.tech.ubm.com/2018/>
Use promo code IBIS for 20% discount on DesignCon registration
<https://designcon.tech.ubm.com/2018> !
_____
BACKGROUND
DesignCon is the premier annual Silicon Valley event for the electronic
design automation (EDA) and semiconductor industry. Topics of current
interest to the IBIS Open Forum are addressed at DesignCon. This meeting
will be conducted as a formal IBIS meeting. Presentations are expected to
be available in an electronic format, and minutes of the meeting will be
issued. Any pending formal decisions (votes) will be announced at least
two weeks prior to the meeting.
CALL FOR PARTICIPANTS
People involved in IBIS Model development, EDA tool development, and
digital circuit design are invited to participate. If you wish to
participate, please register with the information below:
Name:
Company:
Send to:
Lance Wang (lwang@xxxxxxxxxx <mailto:lwang@xxxxxxxxxx> )
Deadline:
January 19, 2018 to reserve for free lunch
CALL FOR PRESENTATIONS
We are seeking presentations from individuals who have IBIS experiences or
issues. Some suggested subjects of interest are:
* Demonstrations of modeling techniques
* Explanations of behavioral algorithms
* Descriptions of difficulties encountered
* Model correlation
* Modeling building experiences
* Comparisons to other modeling methods
* New technologies for modeling buffers and components
* New technologies for modeling packaging and interconnects
* Algorithmic modeling topics
* Ideas for IBIS model users
Presentations may be addressed to any and all levels of IBIS experience,
from beginner to expert.
Electronic Archival:
* We require electronic versions so they can be projected, archived
on the IBIS website <https://ibis.org/> , and made available to
non-attendees.
* We prefer Microsoft PowerPoint* or Adobe PDF*.
* Please send presentations for processing and brief review.
If you plan a presentation, please supply as soon as possible:
Title:
Presenter:
Company:
Estimated Time Required:
Usually 15 to 45 minutes
Send this to:
Bob Ross (bob@xxxxxxxxxxxxxxxxx <mailto:bob@xxxxxxxxxxxxxxxxx> )
Deadline:
Friday, January 19, 2018
Note, vendor-specific, confidential or product promotion material is
forbidden at IBIS summits. Presentations MUST be submitted by the deadline
for review. The IBIS Open Forum reserves the right to reject submitted
presentations or stop a scheduled presentation containing content that has
not been reviewed.
AGENDA
The agenda includes presentations, discussions, breaks, and a FREE lunch.
A final list of speakers and topics will be released one week prior to the
event.
Tentative list of speakers and topics:
* Mike LaBonte, SiSoft
"IBIS Update"
* Arpad Muranyi, Mentor, a Siemens Business
(IBIS Advanced Technology Modeling Update topic)
* Yoshinori Fukuba, JEITA and Toshiba
"Effective simulation set up with latest IBIS models, -cooperation with
IEC 63055 / IEEE 2401"
* Tom Lee, Stanford University
Keynote
* Vladimir Dmitriev-Zdorov, Mentor, a Siemens Business
"Subcircuits, S-parameters and T-line models: Why and How We Set
References"
* Wei-hsing Huang, SPISim
"Using IBIS-AMI in COM Analysis"
* Todd Westerhoff, SiSoft
"Addressing DDR5 design challenges with IBIS-AMI modeling techniques"
* Randy Wolff, Micron Technology
(DDR Equalization topic)
* Arpad Muranyi, Mentor, a Siemens Business
"DDR5 Equalization Options with IBIS"
* Mike LaBonte, SiSoft
"IBIS-AMI Post-Simulation Analysis"
HOTEL AND TRAVEL INFORMATION
See the DesignCon Travel and Venue page
<http://designcon.com/santaclara/registration/travel-and-venue> for hotel
information and transportation suggestions.
C Copyright 2018 IBIS Open Forum
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