BIRD 189.3, Interconnect Modeling Using IBIS-ISS and Touchstone
<http://ibis.org/birds/bird189.3.docx> , has been submitted by Walter Katz
of Signal Integrity Software (SiSoft), Radek Biernacki of Keysight
Technologies, Justin Butterfield and Randy Wolff of Micron Technology,
Curtis Clark of ANSYS, Mike LaBonte of SiSoft, Arpad Muranyi of Mentor
Graphics, Michael Mirmak of Intel Corp., and Bob Ross of Teraspeed Labs.
It will be introduced as an update to BIRD 189.2 in the next IBIS Open
Forum teleconference.
ID#
Issue Title
Requester
Date
Submitted
189.3
Interconnect Modeling Using IBIS-ISS and Touchstone
<http://ibis.org/birds/bird189.3.docx>
Walter Katz, Signal Integrity Software (SiSoft); Radek Biernacki, Keysight
Technologies; Justin Butterfield, Micron Technology; Curtis Clark, ANSYS;
Mike LaBonte, Signal Integrity Software (SiSoft); Arpad Muranyi, Mentor
Graphics; Michael Mirmak, Intel Corp.; Bob Ross, Teraspeed Labs; Randy
Wolff, Micron Technology
January 27, 2017, March 29, 2017; April 19, 2017; April 26, 2017
Mike LaBonte
SiSoft
Chair, IBIS Open Forum
http://www.ibis.org/ ;
