Feras, I do not understand your response. Can you put together a complete example of what you are proposing? Walter From: Feras Al-Hawari [mailto:feras@xxxxxxxxxxx] Sent: Wednesday, February 15, 2012 4:28 AM To: wkatz@xxxxxxxxxx; IBIS-ATM Subject: RE: What I think BIRD145 is try to accomplish is ... Hello Walter, The main goal of BIRD 145 is to directly cascade and call an IBIS I/O model (standard VI/VT based model or an [External Model]) with an [External Circuit] that could be a represenation of ODT, RDL, or package. Based on that, for example, the [External Circuit] could reference an IBIS/ISS subckt that contains your suggested ladder RC circuit. So BIRD 145 would allow you to directly connect your ladder RC circuit (encapsulated inside the [External Circuit]) to its corresponding buffer model using the new [Model Call] subparameter. To accomplish the previous goal based on the current IBIS spec you need to: 1) encapsulate the b-element inside a subckt, 2) reference that b-element subckt from an [External Circuit], 3) connect [External Circuit] that references the I/O model to the [External Circuit] that references the ladder RC circuit. It is obvious that these steps are cumbersome especially when the developer could just directly call the desired IBIS I/O model without the need to develop a SPICE-like wrapper as well as an [External Circuit] section. Based on the above, the goal of BIRD 145 is different from your proposal below. Thanks, Feras _____ From: Walter Katz [wkatz@xxxxxxxxxx] Sent: Tuesday, February 14, 2012 6:24 PM To: IBIS-ATM; Feras Al-Hawari Subject: What I think BIRD145 is try to accomplish is ... Feras, I think the idea behind BIRD145 is similar to what Michael Mirmak proposed several years ago, and what Randy Wolf discussed at the DesignCon IBIS Summit. Both Randy and Michael wanted the ability to add a ladder RC circuit at the output pad of the buffer. This is a real requirement that SiSoft has implemented using an IBIS keyword Final_Stage, FinalStageDiff: Final_Stage <typ|min|max> <ISS file name> <ISS subckt name> and Final_Stage_Diff <typ|min|max> <ISS file name> <ISS subckt name> These are either a 2 port subckt (Final_Stage) or a 4 port subckt (Final_Stage_Diff), that is inserted between the pad(s) of the B element and the pad end(s) of the package). Would this satisfy your IC Vendor modeling requirements? What other ports would need to be included in this subckt? Walter Walter Katz wkatz@xxxxxxxxxx Phone 303.449-2308 Mobile 720.333-1107