All, I am including an updated version of the interconnect capabilities spreadsheet (IBIS_interconn_capabilities_131126.xlsx). I reorganized a the issues we are discussing, but most importantly added a new section "IBIS.org Interconnect Shortcomings". This is a list of industry interconnect requirements interconnect modeling that IBIS currently has no solution. Please note that this is the list I have been targeting for over three years, and EMD was specifically designed to address all of these shortcomings. The first question IBIS has to answer is: 1. Does IBIS want to create standards for IC Vendors to deliver interconnect models that satisfy any, some or all of the requirements listed in rows 2 through 14 of the enclosed spreadsheet? (And is this list complete?) If the answer is yes to any of these requirements, the next questions is: 2. Is it sufficient to satisfy the requirements identified in question 1. with EMD, without enhancing IBIS Component? If the answer to this question is No, then: 3. Which of the requirements identified in question 2. shall be addressed by enhancing IBIS Component? Once these questions are answered, then we can discuss the details outlined in the rest of the spreadsheet. Walter Walter Katz <mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx Phone 303.449-2308 Mobile 303.335-6156
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IBIS_interconn_capabilities_131126.xlsx
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