[ibis-macro] Package power models and on-die Power models
- From: "Walter Katz" <wkatz@xxxxxxxxxx>
- To: "Arpad Muranyi" <Arpad_Muranyi@xxxxxxxxxx>, "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>
- Date: Tue, 26 Jun 2012 14:12:09 -0400 (EDT)
All,
I hope the following example will explain why Power Distribution Models
need to be handled as a Model Connection Wrapper around the power subckts.
P are Power Silicon Bump Pads
P are Power Pins and Pads
B are Buffer Silicon Bump Pads, and IBIS Pins
IBIS file has 6 Power Pins, 8 Buffer Pins
Silicon has 24 Power Bump Pads and 8 Buffer Bump Pads
The Package Pins:
P
B B
P
B B
P
P
B B
P
B B
P
The Silicon Bump Pads
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
For the following Case
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
Package Power Distribution Circuit could have:
1 Power Pin Node, and 1 Power Pad Node
6 Power Pin Nodes, and 24 Power Pad Nodes
2 Power Pin Nodes, and 6 Power Pad Nodes
Or any combination of 1-6 Power Pin Nodes and 1-24 Power Pad Node
On die power distribution can have
1 Power Pad Node, and 1 Power Buffer Node
24 Power Pad Nodes, and 8 Power Buffer Nodes
Or any combination of 1-24 Power Pad Nodes and 1-8 Power Buffer Nodes
Power Distribution can be done for slices:
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
PPPP
B B
PPPP
B B
PPPP
Walter Katz
<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156
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