All, I will be somewhere between Philadelphia and NYC during next Tuesday's meeting, so I may not be able to attend. I think the document I sent out after this past Tuesday's meeting is very close to fully defining the subset of HSPICE that we intend to support. It requires careful review. I think we are now at the stage to decide what formal final document we would want to submit to the Open Forum to approve. I would like us to consider making this document with out any significant changes as the definition of the IBIS Interconnect Spice Dialect, and something like the following to the IBIS Open Forum: IBIS is planning to introduce new methods of modeling connector, package and module interconnect. Each of these new modeling standards will require the need to use SPICE subckts. Because of the large number of SPICE dialects, IBIS ATM has determined the need for a "least common denominator" SPICE dialect called IBIS Interconnect Spice Dialect. Synopsys has given us approval to use HSPICE documentation to define this dialect. The attached document was generated bys cutting and pasting directly from the Synopsys HSPICE manuals. A SPICE subckt is IBIS Interconnect Spice compliant if it follows the syntactical rules described in this document. Below is a list of EDA vendors that have agreed to support this SPICE dialect in subckts in their EDA tools. The IBIS ATM committee hereby request that the enclosed document be approved as the IBIS Interconnect Spice Dialect. List of EDA Vendors registering support for this SPICE dialect. Signal Integrity Software, Inc. Synopsys . I think that this approach can get this done very quickly, and we can move on to using these SPICE subckts in package, connector and module models. Walter Walter Katz Chief Scientist Signal Integrity Software, Inc. wkatz@xxxxxxxxxx 303.449-2308