Oh, I see. But you don't have to write a single model for the entire device, as I explained it in my response to Kukal... Arpad ================================================= From: Walter Katz [mailto:wkatz@xxxxxxxxxx] Sent: Thursday, January 13, 2011 11:41 AM To: Muranyi, Arpad; 'IBIS-ATM' Subject: RE: [ibis-macro] Re: BIRD-125: ISS as package-model Arpad, A single model for a 1000 pin package is unwieldy. If it was an sparam then it might be an s2000p Walter From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Muranyi, Arpad Sent: Thursday, January 13, 2011 12:38 PM To: IBIS-ATM Subject: [ibis-macro] Re: BIRD-125: ISS as package-model Walter, As far as I can tell, you can do all of the items you listed below with the capabilities of IBIS and BIRD 125. By the way, Kukal did not mention anything about the "complexity" of BIRD 125. Also, could you please explain what makes you say "these models are unwieldy"? I really do not see what you are referring to... Thanks, Arpad ===================================================== From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Walter Katz Sent: Thursday, January 13, 2011 9:11 AM To: kukal@xxxxxxxxxxx; 'IBIS-ATM' Subject: [ibis-macro] Re: BIRD-125: ISS as package-model Kukal, ISS supports s parameter instances. I agree with you on the complexity of BIRD-125. Although some applications do require package models for either the whole package or a section of the package, these models are unwieldy. I think that it is important that any package solution have the following capabilities: 1. Ability to specify either singled ended and/or differential models for each single ended or differential pin of the package. 2. Ability to specify a range of single ended/differential package models for each [Model]. 3. Ability to specify a range of coupled package models for each [Model] 4. Ability to specify a range of coupled package models for each pin/diff pin. 5. Ability to specify package models that ties to die pads and package pins, and that it support a different number of die pads and package pins, and also support many-to-few and few-to-many networks of supply nodes between the die pads and package pins of supply nets. Walter From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Taranjit Kukal Sent: Thursday, January 13, 2011 2:26 AM To: IBIS-ATM Subject: [ibis-macro] BIRD-125: ISS as package-model Hi Arpad, The BIRD surely bridges a gap that was very important as almost every package needs to be an s-parameter model at MGH. However, it seems that the BIRD requires the user to always specify one sub-circuit for the whole package. So, if the package had 8, 16, or 100 pins then the user needs to provide a 16, 32, or 200 terminal subckt, respectively. We always get package models as models for single pins or diff-pin(s). I think we should extend the BIRD to include subcircuits per pin (and per-diff-pin) and may be cover cases where several smaller sub circuits can be assigned to subsets of the package pins. Another minor thing is that we are forcing the user to wrap s-parameter files into ISS - Not sure if the syntax should allow direct s-parameter instantiation. This is a surely not a big issue. rgds ..kukal Taranjit Kukal | Product Engineering Architect P: 91 120 3984000 www.cadence.com <http://www.cadence.com/>